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Wednesday 28th June 2006
Veeco Instruments Inc. and Korea Photonics Technology Institute (KOPTI) announced they have entered into a collaborative relationship for the advancement of solid state lighting.
Wednesday 28th June 2006
Veeco Instruments Inc. and Korea Photonics Technology Institute (KOPTI) announced they have entered into a collaborative relationship for the advancement of solid state lighting.
Wednesday 28th June 2006
TriQuint Semiconductor, Inc. announced the intent to open a new design and support centre in High Point, North Carolina. The facility will be known as the North Carolina Design Centre (NCDC), and is part of TriQuint's ongoing program to work more closely with strategic partners and customers in the development of next-generation wireless modules and components.
Wednesday 28th June 2006
The Bosch Group is investing some 550 million euros in the construction of a new manufacturing facility for 200 millimetre (eight-inch) semiconductors at its site in Reutlingen, near Stuttgart. Construction of the facility is to begin in the autumn of 2007. Rollout of production is planned for mid-2009. The plant will have a total capacity of up to 1,000 silicon wafers per day, equivalent to a daily production volume of up to one million microchips. "In investing heavily in state-of-the-art manufacturing technology, we are securing the long-term future of our international automotive electronics business," said Franz Fehrenbach, chairman of the Bosch Board of Management. Bosch has been manufacturing 150-millimeter (six-inch) semiconductors in Reutlingen for ten years now. The location can therefore draw on a wealth of expertise and has a good infrastructure.
Wednesday 28th June 2006
Philips Lumileds Lighting Company announced that it has established new luminance performance records for solid-state lighting technology at 1 Amp.
Tuesday 27th June 2006
NANOIDENT Technologies AG, announced the launch of a new division -- NANOIDENT Biometrics GmbH. The company also announced that this division will be led by Managing Director, Alain Jutant, who brings a deep expertise in biometrics and image sensors to the company.
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Tuesday 27th June 2006
Cree, Inc., announced it has signed a agreement to acquire privately held INTRINSIC Semiconductor Corporation.
Tuesday 27th June 2006
SEMI has published eight new technical standards applicable to the semiconductor, flat panel display (FPD) and MEMS manufacturing industries. The new standards, were developed by technical experts from equipment suppliers, device manufacturers and other companies participating in the SEMI International Standards Program.
Monday 26th June 2006
Plans for Advanced Micro Devices Inc (AMD) to build a new $3.2 billion microprocessor factory in New York will work towards facilitating expansion against rival competitor Intel Corp.
Monday 26th June 2006
Future Horizons plots solid growth for European fabless and IC design, recently published in the 2006 edition of its European Chipless & Fabless Design House Report covering independent IC design companies in Western Europe and Israel
Monday 26th June 2006
The SEZ Group announced it has received multiple-system orders for more than a dozen Da Vinci tools from industry-leading chipmakers based in Taiwan and Singapore.
Monday 26th June 2006
The Advanced Technology Institute at the University of Surrey, and its plasma processing partner CEVP, have won substantial project funding from the South East England Development Agency (SEEDA) to help develop a tool for growing nanomaterials.
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Friday 23rd June 2006
The University Network for the Semiconductor Industry has announced that its modular MSc programme is to close after seven years, although individual modules will continue to be delivered to meet industry demands.
Friday 23rd June 2006
Micronic Laser Systems AB said it has received an order for an Omega6080 laser pattern generator from a customer in Asia.
Friday 23rd June 2006
Intel opened the 65nm Leixlip fab this week to little international fanfare. The event marks Intel's third chip factory using 65nm process technology. The US$2 billion factory has begun high-volume production using 65nm process technology produced on 300mm wafers. Along with Intel's Fab 12 in Arizona and D1D fab in Oregon, the new facility (called Fab 24-2) marks the third venture for the chip maker into 65nm facilities.;
Friday 23rd June 2006
IBM and the Georgia Institute of Technology announced that their researchers have demonstrated the first silicon-based chip capable of operating at frequencies above 500 GHz -- 500 billion cycles per second -- by cryogenically "freezing" the chip to 451 degrees below zero Fahrenheit (4.5 Kelvins). Such extremely cold temperatures are found naturally only in outer space, but can be artificially achieved on Earth using ultra-cold materials such as liquid helium. (Absolute Zero, the coldest possible temperature in nature, occurs at minus 459.67 degrees Fahrenheit).
Friday 23rd June 2006
Semiconductor fab automation tools revenues is expected to grow 50% through 2008 benefiting from the migration to 300mm equipment, according to a new reportfrom the Information Network.
Friday 23rd June 2006
NEC Corporation (NEC) announced the joint development of a new technology for realising low-power and high-performance SOC devices of technology nodes of 65 nm, 45 nm and beyond. The developed technology enables fabrication of a highly reliable metal/high-k gate transistor utilising a simple method.;;
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Friday 23rd June 2006
Fogale Nanotech of France, a renown supplier in the field of ultra-high accuracy dimensional metrology, has appointed Armstrong Optical Ltd of Northants, UK as its exclusive distributor for the UK and Ireland.
Tuesday 20th June 2006
Ten manufacturers of thick film microcircuits have come together to form a new alliance that will provide engineers with a central resource of information on how to use this technology and maximise its benefits in custom electronics design.
Monday 12th June 2006
Semiconductor fab automation tools revenues is expected to grow 50% through 2008 benefiting from the migration to 300mm equipment, according to a new reportfrom the Information Network.
Monday 12th June 2006
QD Vision has. announced it has manufactured the world's first quantum dot display ("QD Display"). The company said the monochrome display demonstrates the potential of quantum dot technology as a foundation for the next generation of displays.
Monday 12th June 2006
Brion Technologies has announced the successful completion of its initial joint development agreement with the Crolles2 Alliance, enabling STMicroelectronics, Philips Semiconductors and Freescale Semiconductor to put Brion's Tachyon LMC, model-based, full-chip, through-process-window, lithography manufacturability verification solution in production on a fully automated 65nm process flow.
Monday 12th June 2006
The first high-resolution, full-color organic light-emitting diode (OLED) display based on a direct photolithographic process was presented by the research group of Professor Klaus Meerholz (University of Cologne, Germany) at this year's Society for Information Display (SID) symposium.

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