Patent licence agreement
Entegris has today that it has entered into a worldwide patent license agreement with 3S Korea Co covering a suite of Entegris patents for 300 mm front opening shipping box (FOSB) products used to transport silicon wafers for semiconductor manufacturing. The agreement, which includes an initial licensing fee and royalty payments for past and future shipments of 300 mm FOSBs, allows 3S Korea to manufacture and sell its 300 mm FOSB.
"This agreement reflects a comprehensive intellectual property strategy that includes licensing certain segments of our patented technologies. This strategy complements our expanding sales of our 300 mm FOSB products which are gaining traction in the market," said William Shaner, Vice President and General Manager of the Microenvironments Division of Entegris. "We are excited to see the value of our state-of-the-industry wafer shipping technologies increase as we grow our licensee base."
With this latest agreement, Entegris has entered into licensing agreements with all but one major shipping box supplier that use similar 300 mm FOSB technology. These agreements leverage the extensive amount of research and development that is done at the company and allow broad access to this innovative technology by wafer manufacturers who need to safely transport wafers to their customers.
