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Monday 12th June 2006
Reporting on such stories is difficult as the first female graduate in this industry should not be news. It is an indictment on the industry and the education system that this is cause for news. Despite this it is a wonderful achievement in a male dominated space.
Monday 12th June 2006
The Czech Republic has announced its newly created Center of Excellence for microelectronics, ChipInvest, will supply top engineering talent from Central and Eastern Europe and Russia to leading and emerging chip companies worldwide.
Saturday 10th June 2006
Soitec has announced the conclusion of an agreement to acquire all the shares of TraciT Technologies, a company based in Grenoble, France. TraciT Technologies specializes in thin-film layer transfer technologies that leverage molecular adhesion and mechanical, as well as chemical, thinning processes for the production of micro-electro mechanical (MEMS) and power circuits.
Friday 9th June 2006
NANOCMOS, a EU-funded IST Integrated Research Project, brings a new dimension to nanoelectronics research by developing close and effective cooperation between universities and nanoelectronics clusters.
Thursday 8th June 2006
Semiconductor manufacturers and their suppliers appear poised to aggressively follow the chip industry's roadmap for extending current lithography technologies and introducing new ones, a SEMATECH-sponsored Litho Forum found recently.
Wednesday 7th June 2006
IMEC has demonstrated the growth of low-sheet-resistivity AlGaN/GaN highelectron mobility transistors (HEMTs) on 150mm silicon (Si) wafers. The process paves the way to low-cost GaN power devices for high-efficiency/high-power systems beyond the silicon limits.
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Tuesday 6th June 2006
SEEDA's funding injection of £215,000 - which raises the project's development capital to £450,000 - will aid the commercialisation of a practical method of mass-producing revolutionary materials such as carbon nanotubes. As a result, industry will gain access to an affordable platform for manufacturing leading-edge products such as ultra-fast semiconductors, low-energy solid-state lighting, and super-efficient solar cells.
Tuesday 6th June 2006
Applied Materials, Inc. announced that its Applied Tetra II Mask Etch system has won the selection for 65nm mask applications at Hoya Corporation, used in semiconductor and LCD (liquid crystal display) production.
Tuesday 6th June 2006
Riber joins IMEC's Industrial Affiliation Program (IIAP) on Germanium (Ge) and III-V devices for CMOS beyond the 22nm node.
Monday 5th June 2006
AIXTRON announced that AIXTRON Taiwan successfully completed its first R&D project funded by the Taiwanese government.
Sunday 4th June 2006
PDF Solutions, Inc. announced that under an engagement that began last year, Infineon Technologies has been implementing PDF Solutions' 90 nanometer (nm) Characterisation Vehicle(R) (CV(R)) infrastructure at its advanced logic fab in Dresden.
Saturday 3rd June 2006
Worldwide sales of semiconductors of $19.6 billion in April were 8.1 percent higher than in April of 2005 when global sales were $18.1 billion, the Semiconductor Industry Association (SIA) reported. SIA reported a nominal decline of 0.4 percent from March, when total sales were $19.7 billion.
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Friday 2nd June 2006
NANOCMOS, a EU-funded IST Integrated Research Project, brings a new dimension to nanoelectronics research by developing close and effective cooperation between universities and nanoelectronics clusters. Indeed NANOCMOS will be succeeded by PULLNANO. The NANOCMOS to PULLNANO transition is the result of a long-term strategy to strengthen collaborative research in Europe in the field of nanoelectronics.
Friday 2nd June 2006
AIXTRON announced that AIXTRON Taiwan successfully completed its first R&D project funded by the Taiwanese government. The project, entitled "Manufacturing-Oriented Research Lab," was part of the program for multinational innovative R&D centres in Taiwan.
Friday 2nd June 2006
Bosch Sensortec announced that the company has signed a distribution agreement with the Japanese distributor Global Electronics Corporation (GEC).
Friday 2nd June 2006
PDF Solutions, Inc. announced that under an engagement that began last year, Infineon Technologies has been implementing PDF Solutions' 90 nanometer (nm) Characterisation Vehicle(R) (CV(R)) infrastructure at its advanced logic fab in Dresden.
Wednesday 31st May 2006
The global semiconductor market is expected to grow 10.1 percent on an annualized basis to $250 billion in 2006, according to the spring forecast of the World Semiconductor Trade Statistics (WSTS).
Wednesday 31st May 2006
IMEC has demonstrated the growth of low-sheet-resistivity AlGaN/GaN highelectron mobility transistors (HEMTs) on 150mm silicon (Si) wafers.
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Tuesday 30th May 2006
AMD announced that it plans to expand its microprocessor manufacturing capacity over the next three years by adding additional 300 millimetre wafer production capabilities in Dresden through the implementation of three new projects.
Tuesday 30th May 2006
Intel Capital has embarked on a bolder, more proactive strategy designed to enhance innovation worldwide by helping its portfolio companies to be more successful through larger investment stakes and more active collaboration.;;
Tuesday 30th May 2006
Semiconductor manufacturers and their suppliers appear poised to aggressively follow the chip industry's roadmap for extending current lithography technologies and introducing new ones, a SEMATECH-sponsored Litho Forum found recently.;
Tuesday 30th May 2006
SEMATECH and the University of Queensland in Australia will collaborate in a project that aims to develop new resists for 193 nm immersion lithography, an emerging technology for advanced semiconductor manufacturing.
Tuesday 30th May 2006
The Holst Centre today announces that Alcatel has joined its research program on wireless autonomous transducer solutions as a "Fellow Traveler" for a two-year period. With this partnership, Alcatel will be able to explore and evaluate potential market opportunities related to fixed access networks and residential multimedia applications based on research from the program on wireless sensor nodes.
Tuesday 30th May 2006
AIXTRON is pleased to announce that Uni Light Technology ordered its next Thomas Swan MOCVD reactor in the first quarter of 2006. AIXTRON expects shipment to be during the second quarter of 2006. The system, a Thomas Swan CCS 19x2" multiwafer reactor, is to be used for the development and manufacture of gallium nitride (GaN) based epitaxial wafer materials for LED devices.

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