ASML Holding (ASML) announced that semiconductor R&D consortium SEMATECH has awarded ASML a contract to qualify the imaging performance of advanced logic patterns, metrology structures and defect designs for the 45-nanometer (nm), 32-nm, and 22-nm technology nodes.
Mentor Graphics Corporation announced that Semiconductor Company, Matsushita Electric Industrial Co., Ltd. has selected the Calibre OPCverify tool for use in production at 65 nanometers (nm) and below.
Magma Design Automation Inc. announced that the withdrawal by Synopsys Inc. of two patents at issue in the lawsuit it filed is a "transparent, desperate attempt" to mask the misdeeds Synopsys committed when it submitted fraudulent patent applications and then attempted to enforce those fraudulently obtained patents against Magma.
Philips announced a collaboration between the MiPlaza shared research facility, Agilent Technologies and Cascade Microtech, to establish an Electronic Measurement Laboratory at MiPlaza on the High Tech Campus Eindhoven.
Dai Nippon Printing (DNP) has Toppan in its sights as it endeavors to take over the lead in the semiconductor photomask market in 2006, according to the report: Mask Making, Inspection, and Repair: Market Analysis and Strategic Issues, recently published by The Information Network.
Taiyo Nippon Sanso Corporation (TNSC) has purchased certain global helium assets from Linde AG and The BOC Group plc, including long-term helium supply contracts with sources in the United States, Poland and Russia.
Chinese semiconductor fab capital expenditures from 2006 through 2008 are expected to exceed US $9.8 billion which is larger than the total capital expenditure of US $8.7 billion in last five years from 2001 to 2005, according to a recent survey of major semiconductor manufacturers in China.
SEMI has established the Manufacturing Technology Forum (MTF) to provide additional oversight and coordination with semiconductor device makers into the industry standards process. The new advisory body will improve the SEMI standards process by providing a forum for collective understanding and collaboration of user requirements during the standards development process.
NanoSensors, Inc, a nanotechnology development company that develops instruments and sensors to detect explosives, chemical and biological agents announced that it has entered into a technology license agreement with Pohang University of Science and Technology, located in Korea, for exclusive rights to Korean patent-pending methods to increase the sensitivity of sensor devices utilizing carbon nanotubes as well as a planned patent application for fabricating single nanowire devices.
Surface Technology Systems have announced the development of a new Deep Reactive Ion Etch (DRIE) plasma source which is compatible with 300mm silicon wafers commonly used in the large scale manufacturing of silicon-based integrated circuits (ICs).
At its new power fab's opening ceremony in Kulim, Infineon Technologies affirmed its number one market position in power semiconductors. Market research firm IMS Research, headquartered in the UK, has named Infineon the leader in worldwide sales revenue for power semiconductors.
Samsung Electronics has announced that it has developed the industry's first 40-nanometer (nm) memory device. The new 32 Gigabit (Gb) NAND flash device is the first memory to incorporate a Charge Trap Flash (CTF) architecture, a revolutionary new approach to further increase manufacturing efficiency while greatly improving performance.
The digital signal processor (DSP) business will regain some of its lost luster in 2006 by growing at nearly twice the rate as the entire IC market this year thanks to strong demand for cellular phones, new investments in broadband communications networks, and the spread of digital video applications in consumer products.