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Tuesday 19th September 2006
ASML Holding (ASML) announced that semiconductor R&D consortium SEMATECH has awarded ASML a contract to qualify the imaging performance of advanced logic patterns, metrology structures and defect designs for the 45-nanometer (nm), 32-nm, and 22-nm technology nodes.
Tuesday 19th September 2006
Veeco Instruments Inc. announced that a leading semiconductor packaging manufacturer has chosen its Wyko SP3250 Optical Profiler to be used for defect inspection and in-line performance monitoring.
Tuesday 19th September 2006
Mentor Graphics Corporation announced that Semiconductor Company, Matsushita Electric Industrial Co., Ltd. has selected the Calibre OPCverify tool for use in production at 65 nanometers (nm) and below.
Tuesday 19th September 2006
iWatt, Inc., announced its acquisition of privately-held Simple Silicon, Inc.
Tuesday 19th September 2006
Scanner Technologies announced it has filed a lawsuit against nVidia Corporation.
Tuesday 19th September 2006
Avago Technologies Limited has filed suit in Hsin Chu District Court against Elan Microelectronics Corporation for patent infringement.
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Tuesday 19th September 2006
Magma Design Automation Inc. announced that the withdrawal by Synopsys Inc. of two patents at issue in the lawsuit it filed is a "transparent, desperate attempt" to mask the misdeeds Synopsys committed when it submitted fraudulent patent applications and then attempted to enforce those fraudulently obtained patents against Magma.
Tuesday 19th September 2006
Fujitsu Limited and Advantest Corporation announced plans to establish a joint venture to create prototype semiconductors by using electron beam direct lithography.
Monday 18th September 2006
Philips announced a collaboration between the MiPlaza shared research facility, Agilent Technologies and Cascade Microtech, to establish an Electronic Measurement Laboratory at MiPlaza on the High Tech Campus Eindhoven.
Monday 18th September 2006
Dai Nippon Printing (DNP) has Toppan in its sights as it endeavors to take over the lead in the semiconductor photomask market in 2006, according to the report: Mask Making, Inspection, and Repair: Market Analysis and Strategic Issues, recently published by The Information Network.
Monday 18th September 2006
MOSIS announced a strategic agreement with SEMPAC that will enable the company to offer customers a low-cost alternative to ceramic packages for VLSI circuits.
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Monday 18th September 2006
Aviza Technology announced that the company has been selected to join a three-year project to develop new transmitter modules for next-generation communication devices.
Monday 18th September 2006
Taiyo Nippon Sanso Corporation (TNSC) has purchased certain global helium assets from Linde AG and The BOC Group plc, including long-term helium supply contracts with sources in the United States, Poland and Russia.
Tuesday 12th September 2006
Chinese semiconductor fab capital expenditures from 2006 through 2008 are expected to exceed US $9.8 billion which is larger than the total capital expenditure of US $8.7 billion in last five years from 2001 to 2005, according to a recent survey of major semiconductor manufacturers in China.
Tuesday 12th September 2006
SEMI has established the Manufacturing Technology Forum (MTF) to provide additional oversight and coordination with semiconductor device makers into the industry standards process. The new advisory body will improve the SEMI standards process by providing a forum for collective understanding and collaboration of user requirements during the standards development process.
Tuesday 12th September 2006
NanoSensors, Inc, a nanotechnology development company that develops instruments and sensors to detect explosives, chemical and biological agents announced that it has entered into a technology license agreement with Pohang University of Science and Technology, located in Korea, for exclusive rights to Korean patent-pending methods to increase the sensitivity of sensor devices utilizing carbon nanotubes as well as a planned patent application for fabricating single nanowire devices.
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Tuesday 12th September 2006
ALIS Corporation, a nanotechnology start-up developing scanning ion microscopes and imaging systems, has announced it has been acquired by Carl Zeiss' Nano Technology Systems Division (NTS).
Tuesday 12th September 2006
Infineon Technologies has announced the opening of its first Asia-based front-end power fab located in Kulim Hi-Tech Park, Malaysia
Tuesday 12th September 2006
Surface Technology Systems have announced the development of a new Deep Reactive Ion Etch (DRIE) plasma source which is compatible with 300mm silicon wafers commonly used in the large scale manufacturing of silicon-based integrated circuits (ICs).
Tuesday 12th September 2006
At its new power fab's opening ceremony in Kulim, Infineon Technologies affirmed its number one market position in power semiconductors. Market research firm IMS Research, headquartered in the UK, has named Infineon the leader in worldwide sales revenue for power semiconductors.
Monday 11th September 2006
Samsung Electronics has announced that it has developed the industry's first 40-nanometer (nm) memory device. The new 32 Gigabit (Gb) NAND flash device is the first memory to incorporate a Charge Trap Flash (CTF) architecture, a revolutionary new approach to further increase manufacturing efficiency while greatly improving performance.
Monday 11th September 2006
The digital signal processor (DSP) business will regain some of its lost luster in 2006 by growing at nearly twice the rate as the entire IC market this year thanks to strong demand for cellular phones, new investments in broadband communications networks, and the spread of digital video applications in consumer products.

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