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Wednesday 31st May 2006
The global semiconductor market is expected to grow 10.1 percent on an annualized basis to $250 billion in 2006, according to the spring forecast of the World Semiconductor Trade Statistics (WSTS).
Wednesday 31st May 2006
IMEC has demonstrated the growth of low-sheet-resistivity AlGaN/GaN highelectron mobility transistors (HEMTs) on 150mm silicon (Si) wafers.
Tuesday 30th May 2006
AMD announced that it plans to expand its microprocessor manufacturing capacity over the next three years by adding additional 300 millimetre wafer production capabilities in Dresden through the implementation of three new projects.
Tuesday 30th May 2006
Intel Capital has embarked on a bolder, more proactive strategy designed to enhance innovation worldwide by helping its portfolio companies to be more successful through larger investment stakes and more active collaboration.;;
Tuesday 30th May 2006
Semiconductor manufacturers and their suppliers appear poised to aggressively follow the chip industry's roadmap for extending current lithography technologies and introducing new ones, a SEMATECH-sponsored Litho Forum found recently.;
Tuesday 30th May 2006
SEMATECH and the University of Queensland in Australia will collaborate in a project that aims to develop new resists for 193 nm immersion lithography, an emerging technology for advanced semiconductor manufacturing.
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Tuesday 30th May 2006
The Holst Centre today announces that Alcatel has joined its research program on wireless autonomous transducer solutions as a "Fellow Traveler" for a two-year period. With this partnership, Alcatel will be able to explore and evaluate potential market opportunities related to fixed access networks and residential multimedia applications based on research from the program on wireless sensor nodes.
Tuesday 30th May 2006
AIXTRON is pleased to announce that Uni Light Technology ordered its next Thomas Swan MOCVD reactor in the first quarter of 2006. AIXTRON expects shipment to be during the second quarter of 2006. The system, a Thomas Swan CCS 19x2" multiwafer reactor, is to be used for the development and manufacture of gallium nitride (GaN) based epitaxial wafer materials for LED devices.
Tuesday 30th May 2006
KLA-Tencor Corporation and ADE Corporation jointly announced that they have amended and restated their existing merger agreement to change the consideration that ADE stockholders will receive from KLA-Tencor common stock to $32.50 per share in cash.
Tuesday 30th May 2006
IMEC has demonstrated the growth of low-sheet-resistivity AlGaN/GaN highelectron mobility transistors (HEMTs) on 150mm silicon (Si) wafers. The process paves the way to low-cost GaN power devices for high-efficiency/high-power systems beyond the silicon limits. The high-quality AlGaN and GaN layers were grown in IMEC's new 150mm metal-organic chemical vapor-phase epitaxy (MOVPE) system. This infrastructure extension allows IMEC to offer access to its AlGaN/GaN epiwafers in a service mode to laboratories and partner companies.
Tuesday 30th May 2006
OLED-T announced that it has raised $7 million venture capital funding led by E-Synergy. Aberdeen Asset Management, Foresight Venture Partners and Gartmore Investment Management have also invested as part of the funding round.
Tuesday 30th May 2006
For the second year in a row, sharp price erosion will curb revenue growth in image sensors during 2006, but once again, strong unit volumes will drive sales to a fifth-straight record level this year. Total shipments of charge-coupled devices (CCDs) and CMOS image sensors are expected to grow 31% this year, reaching 1.9 billion units worldwide, and that will be enough to push sales up 12% and across the $7 billion mark, based on a forecast in IC Insights' 2006 Optoelectronics, Sensor/Actuator, and Discrete (O-S-D) Report.
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Tuesday 30th May 2006
Riber joins IMEC's Industrial Affiliation Program (IIAP) on Germanium (Ge) and III-V devices for CMOS beyond the 22nm node.
Monday 29th May 2006
NANOCMOS, a EU-funded IST Integrated Research Project, brings a new dimension to nanoelectronics research by developing close and effective cooperation between universities and nanoelectronics clusters.
Sunday 28th May 2006
Semiconductor manufacturers and their suppliers appear poised to aggressively follow the chip industry's roadmap for extending current lithography technologies and introducing new ones, a SEMATECH-sponsored Litho Forum found recently.
Thursday 25th May 2006
SUSS MicroTec announced it has received an order for an ABC200 automated production wafer bonding system from Freescale Semiconductor.
Thursday 25th May 2006
SUSS MicroTec announced it has received an order for an ABC200 automated production wafer bonding system from Freescale Semiconductor.
Thursday 25th May 2006
Rudolph Technologies, Inc. all-surface, macro defect inspection system is best of breed.
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Thursday 25th May 2006
Semiconductor shipments to Europe showed a moderate sequential decline, in line with the worldwide trend and the seasonal behaviour for the first quarter of the year.
Wednesday 24th May 2006
Last year Semico touted silicon-on-insulator (SOI) as one of the most effective solutions to achieve the kind of performance and power required by chips today. As it currently remains, the added cost of the substrate material is one of the perceived challenges hindering widespread adoption.
Wednesday 24th May 2006
TRONIC'S Microsystems, announced that it is extending its capabilities for design, frontend/backend manufacturing and electronic interfacing of MEMS components supported by a 1.7MEUR financial round with its institutional investors.
Wednesday 24th May 2006
ARM Holdings plc announces that Sir Robin Saxby, currently Chairman of the Company, will retire from the Board on 1st October 2006 when he takes up the role of President of the Institute of Engineering and Technology (IET). During his year as President of the IET, Sir Robin will remain associated with ARM as Chairman Emeritus.
Wednesday 24th May 2006
Aeroflex and Etherstack have agreed to jointly develop and market a suite of products to support Project 25 (P25) protocol conformance testing. The new products will help ensure mobile stations and base stations conform to the APCO Project 25 family of standards and bulletins published by the Telecommunications Industry Association (TIA).
Wednesday 24th May 2006
SINGULUS TECHNOLOGIES announced the sale of a TIMARIS thin-film deposition system for MRAM wafer production to GRANDIS in Silicon Valley/USA. The two companies also signed a collaborative agreement on advanced TMR film development for MRAM (magnetic random access memory).

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