SigmaTel, Inc. announced that its portable media system-on-chip (SoC) solution enabled Philips MP3 players to surpass the competition and take the lead in Germany and Chile, as the number 1 player in the quantity segment market according to Philips market research.
Semiconductor Research Corporation (SRC), has named well-known semiconductor technology expert Dr. Jeffrey Welser as director for the consortium's Nanotechnology Research Initiative (NRI). Under his direction, aggressive research in nanoelectronics will be conducted in collaboration with U.S. federal and state government research agencies.
Regardless of the application (e.g., digital consumer, networking, mobile), System-on-Chip (SoC) plays an important role in allowing designers to integrate several CPUs, DSPs, caches, memory blocks, I/O controllers, and many more hardware blocks all on a single device.
Royal Philips Electronics announced that the company has signed an agreement with Kohlberg Kravis Roberts & Co. (KKR), Silver Lake Partners and AlpInvest Partners NV (together referred to as "the consortium") through which the consortium will acquire an 80.1% stake in Philips' Semiconductors business, with Philips retaining a 19.9% stake in this business.
Infineon Technologies AG and its subsidiary Qimonda AG announced the conclusion of license agreements with Tessera Inc. Infineon, Qimonda and Tessera have also agreed to settle all outstanding litigation between them.
Excess stockpiles of PC microprocessors and core-logic chipsets caused surplus semiconductor inventories in the global electronics supply chain to rise more than expected in the second quarter, according to new data from iSuppli Corp.'s Semiconductor Inventory Tracker service.
A group of 15 leading European Semiconductor companies, Intellectual Property (IP) vendors, Electronic Design Automation (EDA) companies and academic institutions specialising in advanced silicon chip design announced that they are working jointly in the SPRINT Project to keep Europe at the forefront of System-on-Chip (SoC) development. The project will develop new methodologies and standards to enable efficient reuse and exchange of IP to speed up and reduce costs of SoC design. ; ;
Sandisk announced the appointment of Dr. Atsuyoshi Koike as president of SanDisk Limited (SDKK), the company's wholly-owned subsidiary in Japan. Dr. Koike's primary focus will be on technology and Fab operations at SanDisk's flash wafer development and manufacturing facility at Yokkaichi, where SanDisk has a strategic partnership with Toshiba.
Arrowhead Research Corporation announced that it will begin a collaboration with Dr. Andrew Rinzler to further develop flexible electronic devices made at the University of Florida. Arrowhead will have the first option to exclusively license and commercialize the technology.
Matsushita Electric Industrial Co., Ltd., and Renesas Technology Corp. announced that they have entered the full integration testing of a 45-nm SoC (system-on-chip) semiconductor manufacturing technology.
The Cre8Ventures initiative of Mentor Graphics announced that it has helped incubate start-up Mirics Semiconductor at its Fleet offices, where Mirics has now headquartered their engineering and sales/marketing teams.
Micron Technology, Inc. applauded the Federal Trade Commission's decision that Rambus, Inc., unlawfully monopolized the markets for four computer memory technologies incorporated into industry standards for memory computer chips.
MoSys, Inc. announced that it has completed the basic research and development work for porting MoSys' 1T-SRAM embedded memory technology to the advanced 65nm semiconductor technology node and has initiated macro design work in order to move these designs into high volume consumer SoC's.
Carl Zeiss SMT´s Nano Technology Systems division (Carl Zeiss NTS) and SII NanoTechnology Inc. (SIINT) jointly introduce the NVision 40, the latest member of the industry proven CrossBeam family of combined scanning electron and focused ion beam workstations. The NVision 40 is designed to meet even most ambitious demands in semiconductor, materials and life science applications. By combining the outstanding core technologies of GEMINI electron beam technology, focused ion beam (FIB) and gas injection system (GIS) technology of both market leaders, NVision 40 offers unprecedented product capabilities for cutting-edge nanoscopic imaging, structuring and analysis.
The European semiconductor market ends the second quarter up 1.4% compared to the same quarter of 2005. This result has been mainly driven by the solid growth for Flash memory products, particularly at the end of last year, and partly by a rebound in DRAM sales.
Carl Zeiss SMT´s Semiconductor Metrology Systems Division (SMS), Jena, Germany, announced that the Advanced Mask Technology Centre (AMTC) in Dresden, Germany, has successfully finalized the installation of the new Carl Zeiss SMT multi-generation E-beam mask repair system MeRiT MG. The system, which has been developed within the BMBF* funded project ABBILD, will now be used for the repair of advanced photomasks at AMTC´s facility in Dresden, Germany. AMTC is a Joint Venture of AMD Inc., Infineon Technologies AG and Toppan Photomasks Inc.
AMI Semiconductor, Inc., subsidiary of AMIS Holdings, Inc. announced that it entered into an agreement to acquire the Ultra Low Power (ULP) six-transistor (6T) SRAM and medical System-on-Chip (SOC) ASIC businesses of NanoAmp Solutions Inc. for approximately $21 million in cash, plus an adjustment for closing inventory of the business.
35 new wafer fabs will begin to ramp the industry's monthly capacity to a new high next year forecasts Strategic Marketing Associates (SMA) in a quaterly published fab report. As most of the new fabs that began construction about two years continue to come online in 2007, they will be joined by 8 of the 11 fabs that just began construction in the June quarter.
Germany announces that the Advanced Mask Technology Centre (AMTC) in Dresden, Germany has successfully finalised the installation of the new Carl Zeiss SMT multi-generation E-beam mask repair system MeRiT MG.
ICOS Vision Systems Corporation and IMEC, research centre in nanoelectronics and nanotechnology, have agreed to work together under a two-year Joint Exploration and Development Program (JEDP), in the field of inspection and metrology for three dimensional (3D) packaging. According to market analysts, the market for 3D packaging will grow rapidly over the next years, driven by the quest for smaller and higher performance Integrated Circuits (IC's).