The advancing nanotechnology company NIL Technology has entered an agreement with the Interdisciplinary Nanoscience Center at the University of Aarhus and Aalborg University (iNANO) concerning delivery of stamps for nanoimprint lithography (NIL).
The Fab Owners Association (FOA), the association of semiconductor manufacturing executives and suppliers, has announced that Philips Semiconductors and MagnaChip Semiconductor (Seoul, Korea) have joined the organisation as voting members.
The advancing nanotechnology company NIL Technology has entered an agreement with the Interdisciplinary Nanoscience Centre at the University of Aarhus and Aalborg University (iNANO) concerning delivery of stamps for nanoimprint lithography (NIL).
Achronix Semiconductor Corporation announced that it has completed initial testing on the first silicon of its commercial 90nm FPGA prototype. The testing confirmed that the prototype is capable of running common FPGA performance benchmark designs at up to 1.93 GHZ at 1.2V.
United Test and Assembly Center (UTAC) has opened its second production facility in Singapore, and announced it would invest about S$500 million in the next 5 years in the country to meet increased demand for test and assembly services for semiconductors. The opening ceremony was officiated by Mr Lim Swee Say, Minister in the Prime Minister's Office of the Republic of Singapore.
Kenet Inc. announced that it has entered into a distributor agreement with INNOTECH for representation throughout Japan. INNOTECH, will provide Kenet with assistance in developing business opportunities in Japan.
"This is an important move for us as Kenet establishes its foothold in Asia," said Dr. Gerry Sollner, Kenet's president and CEO. "INNOTECH offers a vast network of contacts in Japan that we will look to bring into play immediately. We are now open for business in Japan."
"We're excited about representing Kenet in Japan," said Takashi Tsumori, president and CEO of INNOTECH."
Corning Incorporated announced that it will locate its liquid crystal display (LCD) glass substrate finishing facility, the first on the China mainland, in the Beijing Economic Technological Development Area.
LSI Logic Corporation announced that it has signed a definitive agreement to sell its Gresham, Oregon semiconductor manufacturing facility to ON Semiconductor Corporation's primary operating subsidiary, Semiconductor Components Industries, LLC.
Dow Corning Corporation has been granted a key patent in Japan covering the use of silicon carbide barrier films between dielectric and metal layers found in the world's most advanced semiconductor devices.
QUALCOMM Incorporated, reported that the Korean offices of QUALCOMM Korea, Samsung Electronics, LGE Electronics and Pantech Curitel were visited on April 4 by officials of the Korean Fair Trade Commission (KFTC) seeking information about the business dealings between QUALCOMM and the three other companies.
Henkel receives industry accolade, bestowed upon the global materials provider at the recent Nepcon China exhibition in Shanghai, China, where the company’s Multicore LF318 lead-free solder paste was awarded the prestigious Electronics Manufacturing Asia Innovation Award in the category of solder materials.
Instrument Systems GmbH is now launching the next generation in the internationally acclaimed Compact Array Spectrometer series – the CAS 140CT. Equipped with high-performance detectors and gratings, the seven models of the CAS140 CT cover a spectral range from 200nm to 2160nm. In combination with optimized control electronics, the new spectrometer technology permits precise acquisition and evaluation of spectra within a few milliseconds.
Rudolph Technologies announced receipt of a multiple-system order from a top-ten U.S. semiconductor manufacturer for its all-surface, advanced macro defect detection system. Each all-surface system consists of a frontside inspection module, a backside inspection module and the new E25 Wafer Edge Inspection System module. This integrated design allows customers to automatically detect, classify and correlate macro defects from the front, back and edge of semiconductor wafers for deposition, lithography, etch and CMP applications.
TMP and BASF announced that they have entered into a license and joint development agreement for copper and barrier CMP-slurries (CMP, Chemical Mechanical Planarization). Under the agreement, BASF will manufacture and distribute these slurries to customers based outside of Japan, who are within the key markets for semiconductor materials. Further developments of the licensed products will be performed jointly with TMP.