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Tuesday 25th April 2006
The advancing nanotechnology company NIL Technology has entered an agreement with the Interdisciplinary Nanoscience Centre at the University of Aarhus and Aalborg University (iNANO) concerning delivery of stamps for nanoimprint lithography (NIL).
Tuesday 25th April 2006
Achronix Semiconductor Corporation announced that it has completed initial testing on the first silicon of its commercial 90nm FPGA prototype. The testing confirmed that the prototype is capable of running common FPGA performance benchmark designs at up to 1.93 GHZ at 1.2V.
Tuesday 25th April 2006
AMO GmbH (AMO), a German research foundry in nanoelectronics, added a new highlight to its nanostructuring equipment.
Monday 24th April 2006
United Test and Assembly Center (UTAC) has opened its second production facility in Singapore, and announced it would invest about S$500 million in the next 5 years in the country to meet increased demand for test and assembly services for semiconductors. The opening ceremony was officiated by Mr Lim Swee Say, Minister in the Prime Minister's Office of the Republic of Singapore.
Monday 24th April 2006
IC Insights' research shows that, in 2006, 16 companies are expected to have semiconductor capital outlays of $1.0 billion or more (Figure1).
Monday 24th April 2006
Kenet Inc. announced that it has entered into a distributor agreement with INNOTECH for representation throughout Japan. INNOTECH, will provide Kenet with assistance in developing business opportunities in Japan. "This is an important move for us as Kenet establishes its foothold in Asia," said Dr. Gerry Sollner, Kenet's president and CEO. "INNOTECH offers a vast network of contacts in Japan that we will look to bring into play immediately. We are now open for business in Japan." "We're excited about representing Kenet in Japan," said Takashi Tsumori, president and CEO of INNOTECH."
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Monday 24th April 2006
Corning Incorporated announced that it will locate its liquid crystal display (LCD) glass substrate finishing facility, the first on the China mainland, in the Beijing Economic Technological Development Area.
Monday 24th April 2006
Silver nanoparticles are emerging as one of the fastest growing product categories in the Nanotechnology industry, according to Bourne Research.
Friday 21st April 2006
Epson Europe Electronics and Arrow Israel signed a distributor's agreement for the Israeli market.
Thursday 20th April 2006
The State Government of Sarawak ("State of Sarawak") and XTRION N.V. announced the merger of 1st Silicon (Malaysia) Sdn Bhd ("1st Silicon") and X-FAB Semiconductor;Foundries AG ("X-FAB"). ;;
Thursday 20th April 2006
LSI Logic Corporation announced that it has signed a definitive agreement to sell its Gresham, Oregon semiconductor manufacturing facility to ON Semiconductor Corporation's primary operating subsidiary, Semiconductor Components Industries, LLC.
Tuesday 18th April 2006
Dow Corning Corporation has been granted a key patent in Japan covering the use of silicon carbide barrier films between dielectric and metal layers found in the world's most advanced semiconductor devices.
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Tuesday 18th April 2006
QUALCOMM Incorporated, reported that the Korean offices of QUALCOMM Korea, Samsung Electronics, LGE Electronics and Pantech Curitel were visited on April 4 by officials of the Korean Fair Trade Commission (KFTC) seeking information about the business dealings between QUALCOMM and the three other companies.
Tuesday 18th April 2006
Henkel receives industry accolade, bestowed upon the global materials provider at the recent Nepcon China exhibition in Shanghai, China, where the company’s Multicore LF318 lead-free solder paste was awarded the prestigious Electronics Manufacturing Asia Innovation Award in the category of solder materials.
Tuesday 18th April 2006
Instrument Systems GmbH is now launching the next generation in the internationally acclaimed Compact Array Spectrometer series – the CAS 140CT. Equipped with high-performance detectors and gratings, the seven models of the CAS140 CT cover a spectral range from 200nm to 2160nm. In combination with optimized control electronics, the new spectrometer technology permits precise acquisition and evaluation of spectra within a few milliseconds.
Tuesday 18th April 2006
Research and Markets has announced the addition of their Asia Pacific Mobile Handset Market Analysis.
Tuesday 18th April 2006
Rudolph Technologies announced receipt of a multiple-system order from a top-ten U.S. semiconductor manufacturer for its all-surface, advanced macro defect detection system. Each all-surface system consists of a frontside inspection module, a backside inspection module and the new E25 Wafer Edge Inspection System module. This integrated design allows customers to automatically detect, classify and correlate macro defects from the front, back and edge of semiconductor wafers for deposition, lithography, etch and CMP applications.
Tuesday 18th April 2006
TMP and BASF announced that they have entered into a license and joint development agreement for copper and barrier CMP-slurries (CMP, Chemical Mechanical Planarization). Under the agreement, BASF will manufacture and distribute these slurries to customers based outside of Japan, who are within the key markets for semiconductor materials. Further developments of the licensed products will be performed jointly with TMP.
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Tuesday 18th April 2006
Datacon has announced full order books, having won a couple of important bids for RFID assembly lines in Europe, North America and Asia Pacific against strong competition.
Thursday 13th April 2006
To further growth in the Asia-Pacific region, the electronics group of Henkel announced several strategic organisational changes designed to position the company as the region's top materials supplier and deliver advanced technology solutions to customers in what has become the geographic centre of choice for high-volume production applications.
Thursday 13th April 2006
In 2006, for the first time in history, the optoelectronics market is forecast to surpass the discrete semiconductor market and become the second largest market segment in the semiconductor industry behind integrated circuits.
Thursday 13th April 2006
Reutlingen – Bosch Sensortec, announced that the company has signed a distribution agreement with Japanese distributor Silicon Technology, under which Silicon Technology will actively market Bosch Sensortec sensor products to the Japanese consumer electronics industry.
Thursday 13th April 2006
SiTime, a privately held Silicon Valley startup, has announced the availability of engineering samples of its SiT1xxx fixed frequency and SiT8002 programmable oscillator families based on its proprietary MEMS First and EpiSeal CMOS compatible processes.
Thursday 13th April 2006
Tokyo Electron Ltd. (TEL) has delivered a new wafer-level Micro-Electro-Mechanical-System (MEMS) Tester, the TEMEON, to a leading MEMS device manufacturer located in Japan.

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