NEC Corporation ("NEC"), NEC Electronics Corporation ("NEC Electronics"), Matsushita Electric Industrial Co. Ltd. ("Matsushita"), Panasonic Mobile Communications Co. Ltd. ("Panasonic Mobile") and Texas Instruments Incorporated ("Texas Instruments") announced that the five companies have signed an agreement to establish a new joint venture company. The company will conduct global development, design, and technology licensing for a hardware and software communications platform (*1) to manage the core communications functions for mobile handsets for the third generation (3G/3.5G) and beyond.
PFC will handle a $100M devices market in 2012. Hybrid cars, solar & wind power and industry will then sustain the growth according to the report, PowerSiC - Status & Forecasts Silicon Carbide Devices for Power Electronics Market by Research and Markets,
Photronics, Inc. announced that Dr. Sang Soo (SS) Choi has been appointed to the position of Chief Technology Officer-Asia. He will report directly to Dr. Christopher Progler, Photronics' corporate Chief Technology Officer.
Micron Technology, Inc., and Intel Corporation announced they are sampling NAND flash memory built on industry-leading 50 nanometer (nm) process technology. The samples were manufactured through IM Flash Technologies, a joint development and manufacturing venture from Micron and Intel.
Bede X-ray Metrology is pleased to announce that it has entered into a collaboration with IMEC, Belgium, to investigate the use of X-ray metrology in the process control of new semiconductor materials used at the 45 nm technology node and below.
Trio-Tech International announced that it is expanding its facility in Suzhou, China to provide specialized testing and burn-in services and manufacture burn-in equipment to serve China's expanding semiconductor, communications and consumer electronics markets.
Micron Technology, Inc., and Intel Corporation announced they are sampling NAND flash memory built on industry-leading 50 nanometer (nm) process technology. The samples were manufactured through IM Flash Technologies, a joint development and manufacturing venture from Micron and Intel. Both companies are sampling 4 gigabit (Gb) devices now, with plans to mass produce a range of densities on the 50nm node in 2007.
Freescale Semiconductor unveiled yet another innovation that could replace BGA and flip chip as the dominant packaging and assembly approach for advanced, highly integrated semiconductors. ;Redistributed Chip Packaging (RCP) technology from Freescale offers unmatched flexibility and integration density -- characteristics that help deliver 30 percent smaller packaged semiconductor solutions versus traditional BGA technology. ;
Oki Electric Industry Co., Ltd and OKI Printing Solutions, a subsidiary of Oki Electric Industry Co., Ltd have expanded their Asian operations with the launch of a sales office in Beijing. The new office, Oki Trading (Beijing) Co., Ltd., has already begun operations to meet growing demand in the printer market, and has been earmarked to provide a wider range of Oki products in the future.
Tegal Corporation announced that Crocus Technology SA, a startup company specializing in magnetic random access memory (MRAM), has placed an order for a Tegal 6500 series critical plasma etch system outfitted with Spectra process modules. Crocus Technology SA of Grenoble, France recently received $17M in funding to commercialize MRAM technology and is in the process of starting a prototype and pilot plant for MRAM production.
Mentor Graphics Corporation announced that the Calibre LFD (litho-friendly design) tool has been used to analyze the layout robustness of ARM Metro products, part of its Artisan physical IP (intellectual property) family at the 65 nanometer (nm) node. The physical IP was analyzed for context dependency and layout robustness to lithographic variation across the manufacturing process window using foundry-supplied silicon simulation models.
Photronics, Inc. announced that ceremonies were held to commemorate grand opening of the Company's semiconductor photomask manufacturing facility. Semiconductor manufacturing customers, government officials and local community leaders joined members of the Photronics management team to tour this newly constructed photomask fabrication facility and meet with members of Photronics' local manufacturing and sales organization. Located in the Zhangjiang Semiconductor Industrial Park, the facility is the first merchant photomask fabrication facility to be brought on-line in the Shanghai region for more than a decade. Production at the facility will be initiated in the fourth quarter of this year.
AMD has changed the way it will function as a company with the acquisition of ATI in Taiwan. The announcement by AMD Chairman and CEO Hector Ruiz means that AMD moves beyond the role of microprocessor manufacturer and will now offer a range of silicon solutions across a wide range of applications. The move will also enable AMD to have more control of IC manufacturing pricing along the silicon food chain. Not all analysts were applauding the move as the industry begins to work out the implications.
ARC International announced it has opened the industry's first comprehensive training centre for configurable processor technology. Based in Hsinchu (the capital of Taiwan's multi-billion dollar semiconductor industry).
Veeco Instruments Inc. announced that it received a record $17 million in second quarter 2006 orders for its automated Atomic Force Microscopes (AFMs). Customers placing orders included those from the semiconductor and data storage industries.
Several leading worldwide photomask manufacturers have selected Veeco's automated AFMs for metrology needs at 45nm and below. Applications for the tool include measurement of critical dimension & 3D metrology on a variety of mask materials (such as MoSi, chrome-on-glass, and resist), and for high-resolution defect review for photomask repair.
Veeco also sold several AFMs to its hard drive industry customers to be used for 3D metrology steps in the development of advanced perpendicular recording heads. Veeco's Auto AFMs provide non-destructive imaging capability which is not currently being satisfied by existing metrology technologies. In addition, the strong second quarter orders also included a system sold for CMOS Image Sensor Technology, where Auto AFM provides in-line measurement for height and width, enabling higher resolution, lower cost image sensors.
Jeannine Sargent, Executive Vice President, Veeco Metrology, commented, "In addition to being used as accurate 3D reference metrology systems in the semiconductor fab, automated AFMs are now finding new applications, such as in photomask manufacturing and in the production of CMOS image sensor technologies, where existing metrology technologies are inadequate. AFMs are also being used by all leading hard disk drive manufacturers for critical measurements required in the production of their next generation perpendicular recording heads."
Veeco Instruments Inc. announced that it received an order during the second quarter of 2006 for its new NEXUS Physical Vapor Deposition (PVD) Multi-Target Sensor tool from a leading manufacturer of thin film magnetic heads. Veeco's NEXUS PVD multi-target system is used to deposit high-quality, extremely uniform, thin film multi-layer stacks and will be used by the customer to manufacture high areal density Tunneling Magneto-Resistive (TMR) heads.
Samsung Electronics, Co., Ltd. announced the qualification of its 65-nanometer (nm) low power process technology manufactured in the company's state of the art 300mm dedicated logic fab. As the consumer handheld device market continues on its phenomenal growth path, the cost efficiencies and power/performance advantages associated with this technology node will enable electronics manufacturers to meet consumers' demand for greater multi-media functionality.
The Silicon Integration Initiative (Si2) and The SPIRIT Consortium announced a strategic partnership and cross-membership agreement to facilitate tighter collaboration designed to improve the productivity of the total system-on-chip (SoC) design flow. The two organizations will work together to coordinate technical roadmaps, targeting consistency of data shared among OpenAccess and Open Modeling efforts provided by Si2 and IP-XACT specifications provided by The SPIRIT Consortium. The organizations will also coordinate an integrated architecture that takes advantage of the highly complementary technology offerings. Technical details will be coordinated through the many common members of both organizations.
SRI International announced it is collaborating with United States-Mexico Foundation for Science to develop a strategy for capturing the opportunities offered by the growing micro-electromechanical systems (MEMS) market and the MEMS R&D capabilities in the state of Puebla, Mexico.
Cadence Design Systems, Magma Design Automation Inc. and Extreme DA, with support from ARM, Virage Logic Corporation, and Altos Design Automation, announced their collaboration to accelerate the creation of a standard statistical analysis library format under the Open Modeling Coalition of Si2. This open statistical library format will be based on current source models. In addition to enabling interoperability between design tools and methodologies for 65-nanometer (nm) design and below, the intent is to create a comprehensive solution that will eliminate the need for designers to support multiple library formats -- a time-consuming and costly undertaking that introduces errors into the design process and delays the delivery of complex integrated circuits (ICs).