Marvell Technology Group, Ltd. and Intel Corporation have announced they have signed an agreement for Intel to sell its communications and application processor business to Marvell. The sale will enable Intel to focus its investments on its core businesses, including high-performance, low-power Intel Architecture-based processors and emerging technologies for mobile computing, including Wi-Fi and WiMAX broadband wireless technologies.
Recent results for Infineon demonstrates continued European strength in the automotive electronics industry. According to the latest study from US market research company Strategy Analytics the sales growth of 11.9 % posted by Infineon’s automotive electronics business in 2005 means that it has once again significantly outperformed the global market as a whole, which expanded by 7.5 % to US $16.4 billion.
Recent results for Infineon demonstrates continued European strength in the automotive electronics industry. According to the latest study from US market research company Strategy Analytics the sales growth of 11.9 % posted by Infineon's automotive electronics business in 2005 means that it has once again significantly outperformed the global market as a whole, which expanded by 7.5 % to US $16.4 billion.
JAM Technologies Inc. announced partnerships with four world-class semiconductor sales distributors in Asia. Newly established relationships with Internix in Japan, Adnet in Korea, Metatech in Singapore and CoreValue in Hong Kong/China, bolster the company's sales force with proven expertise in the consumer electronics semiconductor industry.
TriQuint Semiconductor, Inc. announced the intent to open a new design and support centre in High Point, North Carolina. The facility will be known as the North Carolina Design Centre (NCDC), and is part of TriQuint's ongoing program to work more closely with strategic partners and customers in the development of next-generation wireless modules and components.
The Bosch Group is investing some 550 million euros in the construction of a new manufacturing facility for 200 millimetre (eight-inch) semiconductors at its site in Reutlingen, near Stuttgart. Construction of the facility is to begin in the autumn of 2007. Rollout of production is planned for mid-2009. The plant will have a total capacity of up to 1,000 silicon wafers per day, equivalent to a daily production volume of up to one million microchips. "In investing heavily in state-of-the-art manufacturing technology, we are securing the long-term future of our international automotive electronics business," said Franz Fehrenbach, chairman of the Bosch Board of Management. Bosch has been manufacturing 150-millimeter (six-inch) semiconductors in Reutlingen for ten years now. The location can therefore draw on a wealth of expertise and has a good infrastructure.
NANOIDENT Technologies AG, announced the launch of a new division -- NANOIDENT Biometrics GmbH. The company also announced that this division will be led by Managing Director, Alain Jutant, who brings a deep expertise in biometrics and image sensors to the company.
SEMI has published eight new technical standards applicable to the semiconductor, flat panel display (FPD) and MEMS manufacturing industries. The new standards, were developed by technical experts from equipment suppliers, device manufacturers and other companies participating in the SEMI International Standards Program.
Future Horizons plots solid growth for European fabless and IC design, recently published in the 2006 edition of its European Chipless & Fabless Design House Report covering independent IC design companies in Western Europe and Israel
The Advanced Technology Institute at the University of Surrey, and its plasma processing partner CEVP, have won substantial project funding from the South East England Development Agency (SEEDA) to help develop a tool for growing nanomaterials.
The University Network for the Semiconductor Industry has announced that its modular MSc programme is to close after seven years, although individual modules will continue to be delivered to meet industry demands.
Intel opened the 65nm Leixlip fab this week to little international fanfare. The event marks Intel's third chip factory using 65nm process technology. The US$2 billion factory has begun high-volume production using 65nm process technology produced on 300mm wafers. Along with Intel's Fab 12 in Arizona and D1D fab in Oregon, the new facility (called Fab 24-2) marks the third venture for the chip maker into 65nm facilities.;
IBM and the Georgia Institute of Technology announced that their researchers have demonstrated the first silicon-based chip capable of operating at frequencies above 500 GHz -- 500 billion cycles per second -- by cryogenically "freezing" the chip to 451 degrees below zero Fahrenheit (4.5 Kelvins). Such extremely cold temperatures are found naturally only in outer space, but can be artificially achieved on Earth using ultra-cold materials such as liquid helium. (Absolute Zero, the coldest possible temperature in nature, occurs at minus 459.67 degrees Fahrenheit).
NEC Corporation (NEC) announced the joint development of a new technology for realising low-power and high-performance SOC devices of technology nodes of 65 nm, 45 nm and beyond. The developed technology enables fabrication of a highly reliable metal/high-k gate transistor utilising a simple method.;;
Fogale Nanotech of France, a renown supplier in the field of ultra-high accuracy dimensional metrology, has appointed Armstrong Optical Ltd of Northants, UK as its exclusive distributor for the UK and Ireland.
Ten manufacturers of thick film microcircuits have come together to form a new alliance that will provide engineers with a central resource of information on how to use this technology and maximise its benefits in custom electronics design.