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Wednesday 1st February 2006
Elpida Memory, Inc. (Elpida) announced it has reached an agreement with the United States Department of Justice - Antitrust Division - (DOJ) to plead guilty to certain violations of US antitrust laws.
Wednesday 1st February 2006
Texas Instruments (TI) Incorporated announced it has finalised its acquisition of Chipcon, a leading company in the design of short-range, low-power wireless RF (radio frequency) transceiver devices.
Tuesday 31st January 2006
Rambus Inc announced that Udo Muerle has been named Director of Business Development for its new European office Mr Muerle is responsible for the overall management and direction of Rambus’ strategic customer and partnership relationships in Europe.
Monday 30th January 2006
India Semiconductor Association (ISA), premier representative body of the semiconductor industry in India and Frost & Sullivan, global growth consulting company, announced the launch of its first comprehensive market research reports on the Indian semiconductor industry.
Sunday 29th January 2006
sp3 Inc., supplier of diamond film products, equipment and services, announced a major capital investment from existing partner Seki Technotron Corporation, Japanese sales and marketing company specialising in high technology industries.
Saturday 28th January 2006
Nordic Semiconductor ASA and Nu Horizons Electronics Corporation announced a North American extension of their existing pan-Asian distribution agreement that was agreed in October 2005.
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Saturday 28th January 2006
STMicroelectronics announced the appointment of Jeffrey See as Corporate Vice President and General Manager of ST’s worldwide back-end operations.
Friday 27th January 2006
Novellus Systems, Inc announced Andrew Goh, president of its Southeast Asia operations.
Friday 27th January 2006
Paul Springthorpe has joined Ionpure Technologies as European Technical Manager. He takes responsibility for all areas of technical support and training for Ionpure electro deionisation (EDI)-based products throughout Europe.
Friday 27th January 2006
Tessera Technologies Inc has taken the decision to strengthen its legal defence system by filing a patent law suit against five top integrated circuit manufacturers.
Thursday 26th January 2006
Intel Corporation announced it has reached an important milestone in the development of 45 nanometer (nm) logic technology. Intel has produced what are believed to be the first fully functional SRAM (Static Random Access Memory) chips using 45nm process technology, its next– generation, high–volume semiconductor manufacturing process.
Thursday 26th January 2006
ApNano Materials, Inc, announced that the European Union Commission has approved a grant of ¤11.6 million to develop new composite coatings and lubricants based on ApNano Materials' nanoparticles – the inorganic fullerenes (IF) – which have unique friction and wear reducing properties.
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Thursday 26th January 2006
The global market for MEMS devices and production equipment was worth an estimated $5 billion in 2005. Forecasts predict an increase to $12.5 billion through 2010, an average annual growth rate (AAGR) of more than 20% According to the technical market research report, RGB-270R MEMS: A Roadmap to Technologies and Applications from Business Communications Co., Inc.
Thursday 26th January 2006
Cathode ray tubing has been a standard of display technology for many years. As display technology becomes more progressive, these displays are gradually being replaced with models that are more compact and consume less power. As displays become more and more advanced there are fewer reasons to continue to invest in cathode ray tube (CRT) displays.
Thursday 26th January 2006
DEK has set out a vision for the future that demands wafer level accuracy, six-sigma repeatability and first time print as fundamental capabilities for next generation screen printing in SMT and semiconductor assembly.
Thursday 26th January 2006
Applied Materials, Inc. and IMEC have announced a significant joint effort to develop 32nm and 22nm-node copper/low k interconnect processing technologies using a suite of Applied Materials' most advanced systems. The goal of the joint program is to address critical manufacturing challenges that chipmakers may face as they make the transition to future device generations, helping them to bring new products to market more rapidly while minimising risk
Thursday 26th January 2006
IBM, Sony Corporation and Toshiba have announced the commencement of a new, five-year phase of their joint technology development alliance. As part of this broad semiconductor research and development collaboration, the three companies will work together on fundamental research, related to advanced process technologies at 32 nanometers and beyond. The agreement will help enable the three companies to more rapidly investigate, identify and commercialise new technologies for consumer and other applications.
Thursday 26th January 2006
A company developing biotechnologies for coatings and artificial cells that may treat many health conditions is locating a laboratory at Central Michigan University. Initially, two researchers from Connecticut-based Artificial Cell Technologies Inc. will be located in CMU's Dow Science Complex. One ACT staff person has been at CMU since last summer.
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Thursday 26th January 2006
The Royal Society report, The long-term management of radioactive waste: the work of the Committee on Radioactive Waste Management, recommends that scientific and technical organisations should be involved with the exercise to assess the "weight" that should be given to different criteria being applied to CoRWM's short list of options for the disposal of radioactive waste
Thursday 26th January 2006
The Project on Emerging Nanotechnologies at the Woodrow Wilson International Centre for Scholars announced the release of a report by one of the country’s foremost authorities on environmental research and policy. Examining the strengths and weaknesses of the current regulatory framework for nanotechnology calling for a new approach to nanotechnology oversight.
Thursday 26th January 2006
Macrotron Scientific Engineering GmbH (MSE) announced the expansion of its Frontend division by offering thermal processing systems. MSE expand its Frontend division for semiconductor manufacturing and now offers a solution for rapid thermal processing (RTP) to the semiconductor industry.
Thursday 26th January 2006
Sense Holdings, Inca developer of next-generation biometric and explosive detection security technologies for government and commercial security markets, announced an important recent progress report under a research and development project with the U.S. government's Oak Ridge National Laboratory to develop a new line of handheld multipurpose explosive and chemical detection device products for the global homeland security marketplace.
Thursday 26th January 2006
Texas Instruments (TI) Incorporated announced it has finalised its previously announced acquisition of Chipcon, a leading company in the design of short-range, low-power wireless RF (radio frequency) transceiver devices. This acquisition will expand TI's high-performance analogue portfolio and will enable TI to provide customers with industry-leading ZigBee compliant solutions and a broad range of proprietary radio frequency integrated circuits that enable innovative low-power wireless applications.
Friday 20th January 2006
Infineon Technologies AG celebrated the official opening of its newest development centre in the Romanian capital Bucharest.

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