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Thursday 20th April 2006
The State Government of Sarawak ("State of Sarawak") and XTRION N.V. announced the merger of 1st Silicon (Malaysia) Sdn Bhd ("1st Silicon") and X-FAB Semiconductor;Foundries AG ("X-FAB"). ;;
Thursday 20th April 2006
LSI Logic Corporation announced that it has signed a definitive agreement to sell its Gresham, Oregon semiconductor manufacturing facility to ON Semiconductor Corporation's primary operating subsidiary, Semiconductor Components Industries, LLC.
Tuesday 18th April 2006
Dow Corning Corporation has been granted a key patent in Japan covering the use of silicon carbide barrier films between dielectric and metal layers found in the world's most advanced semiconductor devices.
Tuesday 18th April 2006
QUALCOMM Incorporated, reported that the Korean offices of QUALCOMM Korea, Samsung Electronics, LGE Electronics and Pantech Curitel were visited on April 4 by officials of the Korean Fair Trade Commission (KFTC) seeking information about the business dealings between QUALCOMM and the three other companies.
Tuesday 18th April 2006
Henkel receives industry accolade, bestowed upon the global materials provider at the recent Nepcon China exhibition in Shanghai, China, where the company’s Multicore LF318 lead-free solder paste was awarded the prestigious Electronics Manufacturing Asia Innovation Award in the category of solder materials.
Tuesday 18th April 2006
Instrument Systems GmbH is now launching the next generation in the internationally acclaimed Compact Array Spectrometer series – the CAS 140CT. Equipped with high-performance detectors and gratings, the seven models of the CAS140 CT cover a spectral range from 200nm to 2160nm. In combination with optimized control electronics, the new spectrometer technology permits precise acquisition and evaluation of spectra within a few milliseconds.
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Tuesday 18th April 2006
Research and Markets has announced the addition of their Asia Pacific Mobile Handset Market Analysis.
Tuesday 18th April 2006
Rudolph Technologies announced receipt of a multiple-system order from a top-ten U.S. semiconductor manufacturer for its all-surface, advanced macro defect detection system. Each all-surface system consists of a frontside inspection module, a backside inspection module and the new E25 Wafer Edge Inspection System module. This integrated design allows customers to automatically detect, classify and correlate macro defects from the front, back and edge of semiconductor wafers for deposition, lithography, etch and CMP applications.
Tuesday 18th April 2006
TMP and BASF announced that they have entered into a license and joint development agreement for copper and barrier CMP-slurries (CMP, Chemical Mechanical Planarization). Under the agreement, BASF will manufacture and distribute these slurries to customers based outside of Japan, who are within the key markets for semiconductor materials. Further developments of the licensed products will be performed jointly with TMP.
Tuesday 18th April 2006
Datacon has announced full order books, having won a couple of important bids for RFID assembly lines in Europe, North America and Asia Pacific against strong competition.
Thursday 13th April 2006
To further growth in the Asia-Pacific region, the electronics group of Henkel announced several strategic organisational changes designed to position the company as the region's top materials supplier and deliver advanced technology solutions to customers in what has become the geographic centre of choice for high-volume production applications.
Thursday 13th April 2006
In 2006, for the first time in history, the optoelectronics market is forecast to surpass the discrete semiconductor market and become the second largest market segment in the semiconductor industry behind integrated circuits.
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Thursday 13th April 2006
Reutlingen – Bosch Sensortec, announced that the company has signed a distribution agreement with Japanese distributor Silicon Technology, under which Silicon Technology will actively market Bosch Sensortec sensor products to the Japanese consumer electronics industry.
Thursday 13th April 2006
SiTime, a privately held Silicon Valley startup, has announced the availability of engineering samples of its SiT1xxx fixed frequency and SiT8002 programmable oscillator families based on its proprietary MEMS First and EpiSeal CMOS compatible processes.
Thursday 13th April 2006
Tokyo Electron Ltd. (TEL) has delivered a new wafer-level Micro-Electro-Mechanical-System (MEMS) Tester, the TEMEON, to a leading MEMS device manufacturer located in Japan.
Wednesday 12th April 2006
The Hong Kong Science and Technology Parks Corporation (HKSTP) has recently started operating a wide range of test and measurement equipment from Instrument Systems GmbH.
Thursday 6th April 2006
Winfried Kaiser of Carl Zeiss and Martin van den Brink of ASML were honored with the European SEMI Award for 2006 for their leadership in the development of photolithography technology and Sir Robin Saxby of ARM received the SEMI Special Services Award for his exemplary contributions to the European and worldwide processor design industry. The awards were presented during a reception at the Semicon Europa 2006 exposition last night.
Wednesday 5th April 2006
The formation of the International Alliance of Nanotechnology Regions (IANRegions), a not for profit organization dedicated to creating and sustaining a global network of nanotechnology hubs was announced today at Semicon Europa.
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Tuesday 4th April 2006
Tuesday 4th April 2006
Oxford Instruments has completed the successful installation of a beta test system for its new atomic layer deposition (ALD) tools at the Eindhoven University of Technology (TU/e)
Sunday 2nd April 2006
Recognising Brazil’s position as South America’s largest economy and its increasing importance as a technology leader, Intel Capital, the investment arm of Intel Corporation, has created a US$50 million venture capital fund to promote technology growth in Brazil.
Friday 31st March 2006
Methode Electronics, International and, SensorDynamics announced that they have signed a long-term collaboration agreement.
Thursday 30th March 2006
Air Products announced a series of strategic initiatives to strengthen and expand its growth platforms.

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