UK research company Innos is participating in a collaborative project with Liverpool and Southampton universities that has demonstrated how high performance MOSFETs used in radio frequency applications can be manufactured at a low cost.
A new sampling by IC Insights of first half 2005 actual capital spending outlays by 14 large semiconductor companies shows that five manufacturers spent less than 50 percent of their current budgets in the first six months of this year.
A restructuring of Oxford Instruments Analytical has been announced to better reflect the group strategy set by the new CEO, Jonathan Flint, earlier this year. This strategy is “to be the leading provider of new generation tools and systems for the Physical Science and Bioscience sectors based on our ability to observe and manipulate matter at the smallest scale”.
Two of the UK's, and the world's, leading engineering institutions, the IEE and the IIE, have announced that members of both organisations have voted to create a new Institution. The new Institution will be known as the IET (Institution of Engineering and Technology), and will come into being in early 2006.
SEMATECH researchers have identified a dual damascene method for interconnect integration that could achieve an aggressive industry target for ultra lowk dielectric materials used in semiconductor manufacturing.
The existing lithography mask standard of 4X magnification with 26 mm field size is expected to be resilient enough to take the semiconductor industry to the 32 nm half-pitch technology generation, leading equipment suppliers and manufacturers concluded at a recent lithography workshop.
Industry experts at the 2nd International Symposium on Immersion Lithography, held in Bruges, Belgium, from 12 to 15 September 2005 have concluded that 193nm immersion lithography is the technology for tomorrow and is on track for insertion into volume manufacturing, with good prospects for extendibility to subsequent and extendable for next generations.
According to a Frost and Sullivan report the rising number of participants and falling brand loyalty in the semiconductor marketplace are intensifying competition, thereby compelling participants to offer maximum differentiation with unique value-added products and services.
Infineon Technologies has announced that its revenues in VoIP (Voice over Internet Protocol) CPE (Customer Premises Equipment) products grew at the rate of 300 percent from 2003 to 2004, much higher than the 70.2 percent average for the total market of 102 million US-Dollars (source: iSuppli 2005).
With the 5th release of the MEDEA+ Roadmap for Electronic Design Automation (EDA), key areas of design and research are highlighted with the goal of keeping the European Semiconductor Industry on the leading edge and providing an intriguing glimpse into the future of Design Automation.
Micron Technology have announced the opening of its test and assembly facility expansion in Singapore, Micron Semiconductor Asia PTE Ltd. The 264,778- square foot facility expansion houses state-of-the-art equipment for assembling and testing a wide range of high-density, high-speed memory components and modules.
In press conferences at four cities around the world Texas Instruments (TI) announced a new digital video platform that they hope create a flurry of new products using digital video technology. Unlike past economic growth spurts there is no killer application on the horizon and the semiconductor industry is looking for activities that will increase consumer spending in electronics.
Intellectual property (IP) is becoming increasingly essential in the design and development of semiconductors, a phenomenon that will cause the IP market to grow to more than $2 billion in size by 2009, market analyst iSuppli predicts.