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Wednesday 24th May 2006
SINGULUS TECHNOLOGIES announced the sale of a TIMARIS thin-film deposition system for MRAM wafer production to GRANDIS in Silicon Valley/USA. The two companies also signed a collaborative agreement on advanced TMR film development for MRAM (magnetic random access memory).
Tuesday 23rd May 2006
MEMS consumption in mobile handsets reached US$157 million in 2005, and by 2010, consumption will exceed US$1 billion, reports In-Stat. In addition to the microphones and bulk acoustic resonators that have dominated the MEMS market to date, there are emerging opportunities for inertial sensors (principally accelerometers) and several types of RF components including band/mode switches, matching elements (such as digital varactors) and oscillators, the high-tech market research firm says.
Tuesday 23rd May 2006
MEMS consumption in mobile handsets reached US$157 million in 2005, and by 2010, consumption will exceed US$1 billion, reports In-Stat. In addition to the microphones and bulk acoustic resonators that have dominated the MEMS market to date, there are emerging opportunities for inertial sensors (principally accelerometers) and several types of RF components including band/mode switches, matching elements (such as digital varactors) and oscillators, the high-tech market research firm says.
Tuesday 23rd May 2006
Aviza Technology, Inc. announced the shipment of its next-generation single wafer atomic layer deposition (ALD) system, Celsior, to China's leading integrated circuit (IC) foundry. The Celsior system is targeted for production of 90-nm DRAM chips.
Tuesday 23rd May 2006
Key ASIC and Silterra Malaysia Sdn. Bhd announced a partnership to offer streamlined design-to-manufacture services for ASICs in the mobile and consumer electronics markets.
Friday 19th May 2006
ATDF subsidiary of SEMATECH, and The University of Texas at Austin (UT), have joined forces to create the Advanced Processing and Prototyping Centre (AP2C), a highly specialised R&D program designed to speed leading-edge nanoelectronic technology to the marketplace.
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Friday 19th May 2006
LSI Logic Corporation announced it has completed the sale of its Gresham, Oregon semiconductor manufacturing facility to Semiconductor Components Industries, LLC, the primary operating subsidiary of ON Semiconductor Corporation, for $105 million.;;
Thursday 18th May 2006
A collaboration agreement has been signed between Bekaert, and the Dutch R&D institute, the Holst Centre. Bekaert will join both the Holst Centre's program lines on wireless autonomous transducer systems and system-in-foil products and production.
Thursday 18th May 2006
Plan Optik AG, announced the completion of a new production line for large glass and fused silica wafers.
Thursday 18th May 2006
Synopsys, Inc., was named by TSMC (TSMC), to distribute its production-ready, silicon-validated 65-nanometer (nm) Nexsys(SM) standard cell libraries, I/Os and memory compilers through Synopsys' DesignWare IP library.
Thursday 18th May 2006
Riber joins IMEC's Industrial Affiliation Program (IIAP) on Germanium (Ge) and III-V devices for CMOS beyond the 22nm node. The availability of a unique molecular beam epitaxy (MBE) cluster at IMEC, the Belgian nanoelectronics and nanotechnology research institute, will enable IMEC and its partners to create fundamental know-how on Ge and III-V processing and to develop the core technology ingredients.
Thursday 18th May 2006
Plan Optik AG, announced the completion of a new production line for large glass and fused silica wafers.
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Wednesday 17th May 2006
FEI Company announced that a global Japanese electronics manufacturer has selected FEI's DA 300 in-fab defect analyzer for its factory. The advanced automated system will enable critical root cause analysis in a fraction of the time required by other techniques and will be used for the first time ever to rapidly analyze process defects in CCD semiconductor devices.
Wednesday 17th May 2006
Renesas Technology Corp. and Nanya Technology Corp. announced that both parties have reached a cross-license agreement and a settlement agreement to dismiss the four pending lawsuits filed by Renesas based on claims of patent infringement by Nanya's DRAM products. The specific terms and conditions of the cross-license agreement between the parties including the exchange of patent license rights and financial terms are confidential.
Wednesday 17th May 2006
DynTest Technologies, a new vendor of singulation solutions, enters the market for separation of various substrates used with the production of electronics components.
Wednesday 17th May 2006
Mattson Technology, Inc announced multiple RTP system orders from several major wafer manufacturers in Japan and Korea, where the systems will be used for bulk silicon wafer production.
Wednesday 17th May 2006
Advanced Energy Industries, Inc. announced it has secured a design win for its Sekidenko temperature and emissivity instrument from a leading semiconductor manufacturer.
Wednesday 17th May 2006
Taiwan Semiconductor Manufacturing Company told a packed audience at its 2006 Technology Symposium that the company has fully qualified its 65-nanometer (nm) low power process technology. The announcement officially opens the doors for TSMC to deliver the production-ready 65nm process.
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Wednesday 17th May 2006
ATDF subsidiary of SEMATECH, and The University of Texas at Austin (UT), have joined forces to create the Advanced Processing and Prototyping Centre (AP2C), a highly specialised R&D program designed to speed leading-edge nanoelectronic technology to the marketplace.
Wednesday 17th May 2006
Toshiba made major gains in the first quarter from the NAND flash memory market at the expense of its close rivals, according to a preliminary market-share ranking from iSuppli Corp.
Wednesday 17th May 2006
China is becoming the world hub for both semiconductor manufacturing and consumption, reports In-Stat.
Wednesday 17th May 2006
Photronics Inc. and Micron Technology Inc. announced the formation of a joint venture known as MP Mask Technology Centre LLC ("MP Mask").
Wednesday 17th May 2006
Tokyo Electron Limited (TEL) has announced that it is forming TEL Venture Capital, Inc., a to make strategic seed and early stage investments focusing on promising technological innovations.
Wednesday 17th May 2006
Sierra Design Automation Inc. announced that it has established offices in India to support the growing adoption of its products. Sierra Design Automation will be based in Bangalore, India and will be headed by Raja Subramaniam, General Manager, Sierra Design Automation Pvt. Ltd.

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