Endicott Interconnect Technologies, Inc. has extended its global sales network with the appointment of sales representative firm, NovaPack Technologies, strengthening the company's European infrastructure.
Pushed by the scaling limits of silicon-based devices, SEMATECH engineers have launched a project to investigate alternative materials to Si in MOSFET channels, the critical pathways that allow electrical signals to flow across transistors.
Surface Technology Systems plc (STS) provider of plasma process technologies, announced that it has received multiple orders worth over £1million for its cluster tools from a leading supplier of components for wireless communications.
Essensium, a fabless provider of SoC ASICs (system-on-chip application-specific integrated circuits), announced that is has joined forces with Mind N.V., a provider of embedded Linux, eCos and DSP software integration services.
Cell phones have long been targeted as a major end-use application for MEMS (MicroElectroMechanical Systems) sensors, and accelerometers in particular, but widespread integration hinges on the development of device drivers, not the sensors themselves, according to Bourne Research.
Xponent Photonics, technology innovator of FTTx optical components, announced that it has begun producing production volumes of Silicon Planar Lightwave Circuits (PLCs) at Innovative Micro Technology (IMT).
On the strength of its $26 million immersion tool, ASML maintained its lead in the $4.3 Billion Lithography Market, according to the report "Sub-100nm Lithography: Market Analysis and Strategic Issues," recently published by The Information Network.
The present NAND flash memory glut is not destined to last very long—but even after the overage is resolved, the excess supply will continue to have a significant negative impact on pricing for another memory type: DRAM, according to iSuppli Corp.