Surface Technology Systems (STS) has announced the release of Pegasus, a new Deep Reactive Ion Etching (DRIE) system, optimised initially for silicon etch, that delivers significant improvements in etch process capability, stability and system reliability.
Innovative Micro Technology (IMT) announced that it has passed several key milestones and demonstrated integrated operation with its Rare Cell Purification System (RCPS), including sorting viable human cells at high speeds with greater than 95% purity.
IMEC's ASML XT:1250i step-and-scan system has been upgraded with state-of-the-art hardware. The first exposures show excellent performance in three key areas: improved CD uniformity across the wafer, better overlay numbers up to values comparable to dry 193nm lithography, and a reduction in patterned defectivity.
STATS ChipPAC Ltd. a semiconductor test and advanced packaging service provider announced it has added a new family of extremely thin packaging solutions with profile heights of less than 0.50mm to its packaging portfolio.
The front-end semiconductor equipment market will drop sequentially over the next three quarters before starting an upward track in mid-2006 that will ultimately reach double-digit growth in 2007 and 2008, according to The Information Network market research company.
The Soitec Group, manufacturer of silicon-on-insulator (SOI) wafers for the semiconductor manufacturing industry, announced a technological development using its proprietary Smart Cutô layer-transfer and wafer-bonding technology.
The MEMS Executive Congress, a meeting of leaders in the MEMS commercial and technology fields brought together by the MEMS Industry Group (MIG), today suggested that the market is seeing more rapid product development based on the availability of well tested MEMS components.
St. Petersburg Electro-Technical Insitute still uses the acronym LETI, from the days when the city was Leningrad. Like the French research centre with the same name, the University has a strong history of research and has moved from a state controlled operation to an open house of learning and innovation.
Integrated Sensing Systems, Inc. (ISSYS) of Michigan USA, has announced that it has signed a partnership contract for ISSYS Micro Density Meter products with KEM - Kyoto Electronics Manufacturing Company, of Kyoto, Japan, The ISSYS Micro Density Meter products are based on Micro ElectroMechanical System (MEMS) technology.
STMicroelectronics a supplier of MEMS (Micro-Electro-Mechanical System) devices, has announced that it has expanded its portfolio of three-axis accelerometers with three new models in ever smaller packages.
Semiconductor manufacturing productivity and the resulting technological progress are being threatened by a gap in funding for research and development (R&D), according to a industry survey and white paper commissioned by SEMI and developed by Infrastructure Advisors. If current technology and economic trends continue, the funding gap could exceed $9 billion by 2010, according to the report.
AMD has opened its latest 300mm wafer fab in Dresden in a ceremony attended by Semiconductor leaders and the cream of Germany's political world, demonstrating the strong relationship the company has with the Saxony region.
iSuppli Corp. has boosted its growth forecast for PC unit shipments in 2005 to 10.3 percent, up from 8.2 percent previously, as stellar first-half sales and soaring demand for mobile computers have brightened market prospects.
Samsung Electronics Co. Ltd. nearly doubled its sales of consumer-electronics oriented semiconductors in 2004, using its broad chip portfolio to vault into the market's top ranks, according to iSuppli Corp.
A University of Colorado has developed the first computer-generated model of a tiny, waterwheel-like molecular rotor that has been harnessed to rotate in one direction at different speeds in response to changes in the strength of an electrical field applied from the outside.