Since its commercial inception in 1987 Electrodeionization (CEDI) technology has been subject to continual update and development for new models. Drawing on industry knowledge and individual technological expertise manufacturers have been faced with the challenge of developing the CEDI module design in power applications.
The markets for nano materials, tools and equipment for nanoelectronics totalled US$1,827 million in 2005 and are forecasted to reach $4,219 million by the year 2010, according to Global Nanoelectronics Markets and Opportunities, report from SEMI.
The United States, Japan and Switzerland are putting pressure on China to bolster its intellectual property protection rules, amidst accusations of mass counterfeiting in the world’s most populous nation.
Attracted by the strong sales growth for diminutive active-matrix displays, South Korean suppliers are mounting an aggressive assault on the market for small/medium TFT-LCD panels, challenging the Japanese firms that now dominate this market segments.
Major US chip makers AMD and IBM has broadened the scope of their technology alliance. The expanded alliance now includes early exploratory research of new transistor, interconnect, lithography, and die-to-package connection technologies through to 2011.
One of the founding fathers of nanotechnology has died at the age of 62. Nobel laureate Richard Smalley, a Rice University professor who helped discover buckyballs, the soccer ball-shaped form of carbon, and championed the field of nanotechnology. Smalley, who had battled cancer, died at M.D. Anderson Cancer Center, said a statement from Rice University, the institute where Smalley was based.
Global Crown Capital, an independent, boutique investment firm, announced the launch of research coverage of Nanotechnology and MEMS (MicroElectroMechanical Systems) equities worldwide for the financial industry.
View Engineering has. announced that it has acquired the assets of privately held Micro-Metric, Inc. of San Jose, CA. Founded in 1979, Micro-Metric is a producer of high-magnification, non-contact critical dimension and coordinate nanometrology systems used in the semiconductor, data storage and MEMs industries.
A major fire on Sunday morning partially destroyed the Mountbatten Building at Southhampton University, in particular the area containing the microfabrication facility. Very fortunately, as far as can be ascertained, no one was injured or is missing as a result of the fire.
Despite a substantial and growing portion of the world’s semiconductor manufacturing capacity located in Asia, U.S. and European IC manufacturers are driving the market for front-end equipment tools for copper processing of IC interconnects, according to the report 300mm/Copper/Low-K Convergence: Timing, Trends, Issues, Market Analysis, recently published by The Information Network.
Epichem has announced that Intel Capital has completed an investment in the company. Intel Capital was the only investor in this funding round. The terms of the investment were not disclosed. Epichem has not previously raised funding through venture capital investors.
World Semiconductor Trade Statistics (WSTS) just released show the global market grew at a fairly strong rate. The Asian markets continue to grow at a higher pace than anywhere else but the European figures show a strong steady growth rate that outstrips other geographic regions.
Surface Technology Systems (STS) has announced the release of Pegasus, a new Deep Reactive Ion Etching (DRIE) system, optimised initially for silicon etch, that delivers significant improvements in etch process capability, stability and system reliability.
Innovative Micro Technology (IMT) announced that it has passed several key milestones and demonstrated integrated operation with its Rare Cell Purification System (RCPS), including sorting viable human cells at high speeds with greater than 95% purity.
IMEC's ASML XT:1250i step-and-scan system has been upgraded with state-of-the-art hardware. The first exposures show excellent performance in three key areas: improved CD uniformity across the wafer, better overlay numbers up to values comparable to dry 193nm lithography, and a reduction in patterned defectivity.
STATS ChipPAC Ltd. a semiconductor test and advanced packaging service provider announced it has added a new family of extremely thin packaging solutions with profile heights of less than 0.50mm to its packaging portfolio.