News Article
IP preparation for 3DIC
Room temperature bonding process available for foundries, OEMs, IDMs, OSATs
As the semiconductor industry explores the most effective way to implement true 3D integration of advanced semiconductors, Ziptronix is developing strategies for licensing its patented ZiBond and Direct Bond Interconnect (DBI) technologies across the semiconductor supply chain. By licensing the Ziptronix technology, semiconductor manufacturers can achieve wafer-to-wafer or chip-to-wafer low temperature oxide bonding at the lowest cost of operation for 3D IC integration.
According to Ziptronix CEO Dan Donabedian, the company is uniquely positioned to deliver the low temperature IC bonding process that the semiconductor industry needs to make true 3D IC integration a practical reality. “We’re currently engaged in substantive licensing discussions with customers in multiple market segments at all levels in the semiconductor supply chain, and we anticipate that several license agreements will be reached in the coming months.”
Donabedian explained that the Ziptronix process IP delivers important competitive advantages, and hence, increased value, at each link in the current supply chain. “Our patented bonding and interconnect technologies can be implemented at all levels of the semiconductor supply chain with little additional capital expenditure for new process equipment. In most cases, the Ziptronix technologies can be employed with slight modifications of existing tools.”
“The OEM/IDM customers and fabless semiconductor manufacturers can now begin to develop device designs that use true 3D integration to achieve more functionality through building multilayer chips, instead of relying on traditional 2D device scaling,” he continued. “In turn, semiconductor foundries will now be able to provide their customers a high volume, high throughput wafer-to-wafer bonding process without compromising yields. And the OSATs vendors will have a repeatable, reliable method of wafer-to-wafer and die-to-wafer bonding for constructing specialized electronic modules using silicon wafers as their substrate material.”
The company is operating from a strong base of intellectual property relating to 3D IC integration, particularly in bonding technology. “Ziptronix has developed a significant worldwide patents covering the basic concepts of low temperature oxide bonding,” Donabedian continued. “Because of the depth and breadth of our patent portfolio, we believe that virtually any use of low temperature oxide bonding processes is likely to be covered by one or more of our patents.”
According to Ziptronix CEO Dan Donabedian, the company is uniquely positioned to deliver the low temperature IC bonding process that the semiconductor industry needs to make true 3D IC integration a practical reality. “We’re currently engaged in substantive licensing discussions with customers in multiple market segments at all levels in the semiconductor supply chain, and we anticipate that several license agreements will be reached in the coming months.”
Donabedian explained that the Ziptronix process IP delivers important competitive advantages, and hence, increased value, at each link in the current supply chain. “Our patented bonding and interconnect technologies can be implemented at all levels of the semiconductor supply chain with little additional capital expenditure for new process equipment. In most cases, the Ziptronix technologies can be employed with slight modifications of existing tools.”
“The OEM/IDM customers and fabless semiconductor manufacturers can now begin to develop device designs that use true 3D integration to achieve more functionality through building multilayer chips, instead of relying on traditional 2D device scaling,” he continued. “In turn, semiconductor foundries will now be able to provide their customers a high volume, high throughput wafer-to-wafer bonding process without compromising yields. And the OSATs vendors will have a repeatable, reliable method of wafer-to-wafer and die-to-wafer bonding for constructing specialized electronic modules using silicon wafers as their substrate material.”
The company is operating from a strong base of intellectual property relating to 3D IC integration, particularly in bonding technology. “Ziptronix has developed a significant worldwide patents covering the basic concepts of low temperature oxide bonding,” Donabedian continued. “Because of the depth and breadth of our patent portfolio, we believe that virtually any use of low temperature oxide bonding processes is likely to be covered by one or more of our patents.”
