Two companies report staff reduction plans - Freescale, Motorola's IC subsidiary, is to lose 1000 jobs and Cymer, the deep ultraviolet (DUV) excimer laser producer, is to cut 14% of its workforce in Q4.
Teseda has made deals for transportability of Standard Test Interface Language (STIL) design-for-test (DFT) data between its OpenDFT WorkBench engineering software and production test platforms supplied by Advantest and Yokogawa Electric.
Ferroelectric semiconductor technology developer Ramtron International announced that its FM25640 64Kbit serial SPI FRAM non-volatile memory product is now qualified under the Automotive Electronic Council's Stress Test Qualification for Integrated Circuits (AEC Q100).
International Rectifier (IR) introduced a new power packaging technology designed to solve challenges found in electro-hydraulic power steering (EHPS), electric power steering (EPS) and automotive motion control applications.
Infineon Technologies announced a new family of "green" power MOSFETs using a new process technology, OptiMOS-T, incorporating 55V trench power technology. The PROFET family of smart high-side switch ICs is claimed as the world's first to use trench power technology.
BOC Edwards has purchased a 50% ownership in Taiwanese Asia Union Electronic Chemical (AUECC) from UPC Technology (UPC). The aim is to expand BOC Edwards electronic materials offering to include resources and expertise in purification, blending, packaging and distribution of wet chemicals for flat panel display, semiconductor and solar cell customers throughout Asia.
Trikon Technologies has shipped its Sigma fxP metal deposition equipment to CEA Leti (Laboratoire d'Electronique de Technologie de l'Information) in Grenoble, France. The system will be used for the research and development of bulk acoustic wave (BAW) resonators, a signal filter technology used in cell phones, Bluetooth and WLAN systems.
Freescale Semiconductor, Motorola's semiconductor spin-off, and TSMC have signed an agreement to jointly develop a new generation of silicon-on-insulator (SOI) high-performance transistor front-end technology targeted for the 65nm CMOS process node.
The European Commission (EC) has decided to formally ask France, the Netherlands, Finland and Sweden for information on certain invitations to tender launched by authorities in those countries for the supply of computer equipment.
Chip manufacturer Philips, research institution RWTH Aachen and equipment supplier AIXTRON signed a collaboration agreement aiming at the joint development of large-area white organic light emitting diodes (OLED).
ASM International has entered into an agreement with Europe's IMEC research centre to deliver a full suite of 300mm front-end-of-the-line (FEOL) semiconductor wafer processing equipment and to participate in several of IMEC's research programs as a strategic partner.