Wednesday 10th November 2004
STMicroelectronics claims a first with its introduction of a Megapixel mobile-camera chipset compliant with the Standard Mobile Imaging Architecture (SMIA). The new mobile-camera kit consists of a camera module (VS6650) and mobile imaging processor (STV0976). ST and Nokia released the SMIA spec in July 2004.
Wednesday 10th November 2004
The bitter dispute between Infineon Technologies and ProMOS Technologies has ended with agreement regarding ProMOS' license of Infineon's DRAM technologies transferred to ProMOS.
Wednesday 10th November 2004
Researchers from Cornell University, USA have built a microscopic device using silicon that can detect viruses in minuscule amounts.
Wednesday 10th November 2004
Japanese paper maker Oji Paper Ð in association with FEC Group and Toppan Forms Ð has developed technology to embed semiconductor chips in paper.
Wednesday 10th November 2004
The current downturn in the semiconductors equipment market is likely to be "longer" and "more severe" than has previously been estimated, claims Goldman Sachs Global Investment Research.
Wednesday 10th November 2004
The current downturn in the semiconductors equipment market is likely to be "longer" and "more severe" than has previously been estimated, claims Goldman Sachs Global Investment Research.
Wednesday 10th November 2004
Only 69% of contract electronics manufacturers believe they will be fully compliant with European Union (EU) environmental legislation by the July 2006 deadline prescribed by the Restriction of Hazardous Substances (RoHS) directives, according to research by Technology Forecasters (TFI) and components distributor Avnet Electronics Marketing.
Wednesday 10th November 2004
The bitter dispute between Infineon Technologies and ProMOS Technologies has ended with agreement regarding ProMOS' license of Infineon's DRAM technologies transferred to ProMOS.
Wednesday 10th November 2004
STMicroelectronics claims a first with its introduction of a Megapixel mobile-camera chipset compliant with the Standard Mobile Imaging Architecture (SMIA). The new mobile-camera kit consists of a camera module (VS6650) and mobile imaging processor (STV0976). ST and Nokia released the SMIA spec in July 2004.
Wednesday 10th November 2004
A team of scientists from Philips and the Kavli Institute of Nanoscience Delft claims the world first growth of III-V semiconductor nanowires on germanium and silicon substrates (Nature Materials, November 2004).
Wednesday 10th November 2004
OmniVision Technologies claims a world first with a 5Mpixel CMOS image sensor, promising lower costs for high-end products.
Wednesday 10th November 2004
Researchers from Cornell University, USA have built a microscopic device using silicon that can detect viruses in minuscule amounts.
Wednesday 10th November 2004
AMD and Chartered Semiconductor Manufacturing have entered into sourcing and manufacturing technology agreements. Chartered will implement under license portions of AMD's Automated Precision Manufacturing (APM) advanced process control (APC) software suite and become an additional manufacturing source of AMD64 microprocessors.
Wednesday 10th November 2004
BOC Edwards is building seven gas plant facilities to ensure bulk gas supply to nine new semiconductor and flat panel display fabs. The gas supply schemes, paving the way for these multiple supply contracts, are being developed as part of a $75mn investment with BOC's long-term joint venture partner, BOC Lienhwa Industrial Gases (BOCLH).
Wednesday 10th November 2004
Tetreon Technologies has acquired the manufacturing rights, intellectual property and inventory for the Thermco horizontal furnace (HTR) product line from Aviza Technology. The purchase gives Tetreon full rights to manufacture and support horizontal furnace products that were originally marketed under the Thermco name and later produced by Silicon Valley Group and ASML.
Wednesday 10th November 2004
Credence Systems plans to reduce costs, improve operational efficiency and maximise productivity with the consolidation of three separate manufacturing facilities into one located in Hillsboro, Oregon. As a result, two former NPTest facilities in California will be closed.
Wednesday 10th November 2004
ASML announced details of a fourth customer in the tough Japanese market. Matsushita Electric Industrial (MEI) has ordered ASML's TWINSCAN lithography system for 300mm production. MEI manufactures consumer products under the Panasonic brand. The sale marks a milestone in ASML's expansion within the Japanese market, which traditionally has been dominated by local lithography companies, namely Nikon and Canon.
Wednesday 10th November 2004
The US Semiconductor Industry Association (SIA) is predicting record chip sales in 2004 of $214bn, an increase of 29.5% on 2003. By 2007, IC revenues are expected to reach $259bn. This last figure is expected to come through essentially a flat market next year, 6.3% growth in 2006 and a 14.2% increase in 2007.
Wednesday 10th November 2004
AMD and Fujitsu's joint Spansion Flash memory subsidiary has presented a three-year vision and strategic road map, outlining plans to scale its MirrorBit technology to 8Gbit densities on 65nm lithography to meet the demands of the entire Flash market - from wireless handsets and embedded systems to detachable cards and USB drives.
Wednesday 10th November 2004
IC packaging services supplier STATS ChipPAC has expanded its die stacking technology to include two leadframe based performance packages - an Exposed Pad Thin QFP (TQFP-ep) and a Quad Flat No Lead (QFN) format.
Wednesday 10th November 2004
eMagin has been granted a US patent covering invention of an innovative gray-scale pixel driver for electronic displays (No.6,809,710).
Wednesday 10th November 2004
OSRAM Opto Semiconductors has developed new packaging technology for use in its infrared (IR) emitter diodes and detectors.
Wednesday 10th November 2004
The VSI Alliance (VSIA) released a Virtual Component Identification Soft IP Tagging standard v1.0" (IPP 4 1.0) to its general membership.
Wednesday 10th November 2004
Toshiba has filed suit against Hynix Semiconductor in Japan and the USA for infringement of semiconductor memory patents.
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