Monday 20th September 2004
Agere Systems have announced from its UK office that its engineers have found the right mix of packaging ingredients to enable the semiconductor industry to successfully implement lead-free packaging. The company's states that research found a tin-nickel combination in semiconductor packaging mitigates "tin whisker" problem and improves long-term reliability of lead-free devices. To solve the problem, Agere added a layer of nickel between the layers of tin and copper and discovered that tin whisker growth was mitigated in that scenario.
Monday 20th September 2004
Asyst Technologies has announced today that it will team with IBM Global Services to provide a full range of manufacturing automation solutions for the worldwide semiconductor marketplace. The agreement will provide Asyst with a worldwide integration service that will enable them to enhance current technology and have a foot in the door for future growth in new industries.
Thursday 16th September 2004
Photronics and SIGMA-C plan to combine their respective technologies to strengthen Photronics' Integrated Lithography Plane (ILP) initiative. Photronics' aim is to provide design and mask integration support to semiconductor companies transitioning to the 65nm and 45nm technology nodes.
Thursday 16th September 2004
Infineon Technologies has reached an agreement with the Antitrust Division of the US Department of Justice (DoJ). The DRAM producer plans to plead guilty to a single and limited charge related to the violation of US antitrust laws in connection with pricing.
Wednesday 15th September 2004
Fraunhofer Institute for Silicon Technology (ISIT), Siemens and Infineon announced proposed development of electronic biochip technology along with their nomination for the German Federal President's Deutscher Zukunftspreis technology and innovation award for work already carried out.
Wednesday 15th September 2004
The UK government has awarded funding to Trikon Technologies to develop "Broad Ion Beam Deposition" (BIBD) technology for 300mm magnetoresistive random access memory (MRAM) manufacture.
Wednesday 15th September 2004
IBM and SUSS MicroTec have signed an agreement to develop and commercialise IBM's next-generation, 100% lead-free semiconductor packaging technology called the Controlled Collapse Chip Connection New Process (C4NP).
Wednesday 15th September 2004
Canon and Toshiba have agreed to establish a joint venture in October 2004 for the development, production and marketing of next-generation flat-screen "surface-conduction electron-emitter display" (SED) panels.
Wednesday 15th September 2004
Bookham has successfully completed its change of domicile to the USA.
Wednesday 15th September 2004
US DRAM producer Micron Technology has made a multi-year business agreement for ASML MaskTools to enhance the capability of Micron's lithography tools through resolution enhancement techniques (RETs).
Wednesday 15th September 2004
iSuppli has "trimmed" its IC forecast for 2005. The market researcher sees a slowing in world semiconductor revenue growth in H2 2004, with the main impact in Q4.
Wednesday 15th September 2004
FEI has released its first DualBeam mask repair system aimed at the 65nm node.
Wednesday 15th September 2004
A quantum mechanical 3D simulator for semiconductor devices has been created under the EU Nanotechnology Computer Aided Design (NANOTCAD) project.
Wednesday 15th September 2004
The European Solar Test Installation (ESTI) at the European Commission's Joint Research Centre has been awarded Accredited Calibration Laboratory status.
Wednesday 15th September 2004
Texas Instruments has designed inlay radio frequency identification (RFID) products for circular products such as CD/DVD disks.
Tuesday 14th September 2004
The UK government has awarded funding to Trikon Technologies to develop “Broad Ion Beam Deposition” (BIBD) technology for 300mm magnetoresistive random access memory (MRAM) manufacture. The total value of the award is up to 50% of the project value of GBP3.29mn ($5.92mn), with the work expected to last 18 months.
Tuesday 14th September 2004
A quantum mechanical 3D simulator for semiconductor devices has been created under the EU Nanotechnology Computer Aided Design (NANOTCAD) project. The Simulator for Nanodevices (SIMNAD) can be used to compute the quantum mechanical charge density and tunnel probabilities in semiconductor nano-structures of diverse material geometries. SIMNAD acts complementarily to the commercial DESSIS-ISE device simulator, allowing the interchange of data and simulations in coupled mode. The coupling scheme of the two simulators provides a package enabling the simultaneous modelling of a 3D quantum-mechanical charge distribution in a sub-region of a larger device, which is under full operation.
Tuesday 14th September 2004
The Fraunhofer Institute of Integrated Systems and Device Technology (IISB) and SIGMA-C have incorporated “smart decomposition simulation” capabilities into SIGMA-C's SOLID lithography simulator.
Tuesday 14th September 2004
IBM and SUSS MicroTec have signed an agreement to develop and commercialise IBM's next-generation, 100% lead-free semiconductor packaging technology called the Controlled Collapse Chip Connection New Process (C4NP).
Friday 10th September 2004
Defence electronics specialist Thales and the French atomic energy commission CEA have formed a new joint laboratory to work on radio frequency micro electro mechanical systems (RF MEMS). It is hoped to use microelectronics and electro-mechanical functions to miniaturise certain critical microwave components while improving their performance.
Friday 10th September 2004
Acreo in Sweden is looking for partners where its capability for advanced and special-purpose surface treatment, chip mounting and wire bonding can be further exploited and advanced. Partners within the industrial or university R&D sectors are of interest.
Friday 10th September 2004
The European Solar Test Installation (ESTI) at the European Commission's Joint Research Centre has been awarded Accredited Calibration Laboratory status. ESTI has become the first laboratory world wide to independently demonstrate the calibration and traceability of the power measurements of solar electricity systems to the SI international system of units.
Thursday 9th September 2004
Israeli metrology tool developer Tevet Process Control Technologies has received an approved supplier designation from Novellus.
Thursday 9th September 2004
Japan's Ricoh has licensed Sarnoff Europe's TakeCharge technology, which allows integrated circuit (IC) designers to create on-chip electrostatic discharge (ESD) protection circuitry. This enables robust specification performance on first implementation, shortening time to market by eliminating costly, time-consuming redesigns.
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