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Industry News
Company News
The applications driving materials informatics
Semiconductor metrology and inspection market to reach $15.8 billion by 2034
Infineon opens Dresden fab
AI reshapes back-end equipment
Intel to invest €5 billion to expand European manufacturing output
Fraunhofer advances CMOS-compatible infrared sensor technology
BAM plays key role in building a European Digital Infrastructure for Materials Research
Applied Materials unveils chip making systems for AI memory and packaging
AI investment expected to drive semiconductor industry past $2 trillion by 2027
Electronic Design Automation market size worth $43.07 billion by 2034
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Technical Insight
How materials will unlock the future of advanced packaging
Seeing beneath the surface
The “Silicon Crossroads”: A visit to BOI Thailand as the nation bets big on chips
Unleashing the intelligence revolution
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Cirrus Logic receives Scottish Enterprise Grant to advance smart energy innovation
FormFactor and Keystone Microtech form strategic partnership
LOI for CHIPS R&D award advances the optical technologies powering AI and high-performance computing
Synopsys and Intel Foundry fast-track customer rreadiness
Synopsys advances agentic AI chip design with AMD and Microsoft
Synopsys showcases NVIDIA collaboration
Renesas Gen 3 MRDIMM Chipset solutions advance DDR5 memory performance
Cadence certifies AI-driven reference flows for Intel 18A-P and Intel 14A
VON ARDENNE appoints Stephen Strausser as CEO of the Americas
Siemens advances self-verifying agentic AI workflows for semiconductor and PCB design
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Analyst and Vendor Views
Pfeiffer Vacuum+Fab Solutions to Showcase Semiconductor Solutions at SEMICON Southeast Asia 2026
Sintered sinthetic cristoblate
Ensuring the reliable and long-lasting operation of cutting-edge semiconductor fabrication with thermoplastic pipe stress analysis
SONOTEC attends European CMP and WET Users Group Meeting in Leuven, Belgium
Analyst and Vendor Views
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2026 Issue 5
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FTD Solutions joins imec’s research program for advanced sustainable semiconductor manufacturing
CEA-Leti scales ferroelectric RAM to 22nm node
Beyond the Copper Wall
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