Advantest announces Call for Papers for VOICE 2026 Developer Conference
VOICE is the leading conference for the growing global community of users and strategic partners involved with Advantest’s V93000 and T2000 SoC test platforms, handlers, test cell solutions, product engineering and technology development. The annual conference brings together semiconductor test professionals representing the world’s leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsourced semiconductor assembly and test (OSAT) providers to discuss the latest technological advancements and network with peers.
“With nearly two decades of impact, VOICE continues to serve as a successful global forum for professionals to connect, collaborate, and stay ahead of evolving industry trends and technologies,” said Farida Chandran, VOICE 2026 General Chair and high-performance digital applications team, Advantest America. “This year’s program is designed to highlight the latest advancements in test and measurement, with a strong focus on technologies like artificial intelligence (AI), high-performance computing (HPC), advanced packaging and silicon photonics. We encourage all attendees to take full advantage of the networking opportunities and in-depth technical sessions to gain valuable insights into the future of innovation.”
Like in previous years, VOICE 2026 will offer a wide array of learning opportunities through technical presentations, keynote addresses and technology kiosks. Advantest’s VOICE 2026 call for papers focuses on these technology tracks and suggested topic areas:
- Artificial Intelligence — AI-aided testing, AI-generated code, smart data innovation and big data analytics, solutions addressing AI.
- High-Performance Digital — High-performance computing, high-end mobile processors and power distribution.
- NEW Silicon Photonics — Integrated photonic chips that use light instead of electrons to transmit data.
- NEW APAMs — Analog, power, automotive and mixed signal.
- T2000 — Automotive controllers, microcontrollers, power ICs, massive parallelism, system-level testing for system in package (SiP), display driver testing.
- Radio Frequency — All topics for RF, including 5G and mmWave.
- Test Methodologies — Supporting standards and protocols, solutions for the latest testing challenges, cost of test reduction, throughput improvements and time-to-market improvements.
- Hardware and Software Design Integration — Utilizing the latest hardware or software features, test cells and new test system enhancements.
- Hot Topics — New market drivers and future trends, secure ID and cyber security, secure cloud, video streaming/telepresence, Internet of Things (IoT) (wearables, sensors, smart cities and homes).
- Device/System Level Test — Specific procedures, multiple-input and multiple-output (MIMO) testing, next-generation embedded processors, broadband fiber to the home, testing ICs for autonomous vehicles, and multi-chip system-in-package devices.
- Factory Automation — Methodologies, tools, and best practices that address the challenges in device production, improving test data quality, reducing test excursion, improving overall equipment effectiveness (OEE), yield and uptime, and improving cost management.
Test developers and engineers can submit their abstracts to be considered for presentation at https://voice.advantest.com/call-for-papers/. To be considered, submissions must be received by Nov. 7, 2025. Accepted abstracts will be notified on Dec. 30, 2025. Attendees at the conference sessions in May 2026 will vote for the best papers via the VOICE mobile app, with winning presenters receiving prizes and awards during the closing ceremonies.
