ACM Research expands Ultra C Tahoe into multi-process wet processing platform
Adds advanced wet etch and monitor wafer reclaim applications for logic and memory manufacturing
The
platform now supports a broader range of advanced wet processing
applications for logic and memory device manufacturing. It has been
adopted by several leading semiconductor manufacturers, demonstrating
its production readiness, versatility and scalability.
Based on ACM’s proprietary hybrid wet processing technology, the Ultra C Tahoe combines batch and single-wafer processes within a common architecture. This allows multiple advanced wet processes to be performed on a single platform.
The system combines the longer processing times and lower chemical consumption of batch cleaning with the high particle-removal efficiency, reduced wafer-to-wafer cross-contamination and precise process control offered by single-wafer cleaning.
ACM has also added monitor wafer reclaim capabilities for advanced process nodes. By consolidating processes previously performed on separate tools, the hybrid platform reduces wafer transfers and cycle times while improving particle-removal performance and throughput.
“As semiconductor manufacturing becomes more complex, customers need solutions that improve productivity while remaining flexible enough to support evolving process requirements,” said Dr David Wang, President and Chief Executive Officer of ACM.
“Expanding Tahoe into a multi-process platform demonstrates the versatility of our hybrid architecture and its scalability for advanced semiconductor manufacturing. ACM will continue to deliver world-class process performance while integrating environmental benefits into product development, helping make advanced semiconductor manufacturing more efficient and sustainable.”
New applications and key benefits
Expanded process capabilities: The addition of bench nitrogen bubbling technology extends the platform’s support for advanced wet processing applications. These include uniform silicon nitride recess etching, polysilicon etching and etch-back, tungsten recess processing and silicon-germanium recess etching.
Combined with ACM’s proprietary SAPS, TEBO and SMT technologies, as well as hot IPA drying, the platform provides integrated etching, advanced cleaning and drying while minimising damage to patterned structures.
More efficient monitor wafer reclaim: Monitor wafers are used to track tool conditions and process stability. The Tahoe Recycle process supports film and residue removal, cleaning and drying on a single hybrid platform, reducing wafer transfers and shortening cycle times.
It also provides enhanced film-removal capabilities for double-sided coated and thick-film wafers, improving wafer cleanliness and overall process efficiency. The Tahoe Recycle application is now operating in volume production at customer facilities.
Enhanced particle and contamination control: The Ultra C Tahoe has achieved an average particle count of fewer than six particles at 26 nm, with surface metal contamination below 1 × 10⁹ atoms/cm².
Environmental and cost benefits: The platform can reduce sulphuric acid consumption by up to 75 percent, helping to lower high-volume manufacturing costs, reduce chemical waste and support customers’ sustainability goals.
