PR Hoffman introduces diamond-like coated carrier for advanced wafer polishing
The PR Hoffman DLC Carrier features a highly uniform diamond-like carbon coating that provides exceptional wear resistance while maintaining the precision required for advanced wafer polishing processes. A reworkable insert design further extends carrier life, helping manufacturers reduce replacement frequency, minimize maintenance and increase equipment uptime.
“As semiconductor manufacturers adopt more advanced materials and packaging technologies, the demands placed on polishing consumables continue to increase,” said Jason Brown General Manager at PR Hoffman. “Our new DLC Carrier delivers the durability and consistent performance customers need to improve productivity while lowering operating costs.”
The DLC Carrier is engineered for demanding applications including silicon carbide (SiC), gallium nitride (GaN), photonics and advanced packaging, where process stability and long-term durability are essential for achieving high yields. By combining extended service life with consistent polishing performance, the new carrier enables customers to maximize productivity while reducing consumable costs over the life of the product.
The PR Hoffman DLC Carrier is available for a variety of wafer polishing platforms, wafer types and sizes and can be configured to meet specific customer requirements.
