TRI to showcase semiconductor inspection solutions at SEMICON West 2026
Visit TRI's Booth No. 5972 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions. TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology,μBump, Cu Pillar, Surface Topology, Profiling, Wafer Thickness, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding. TRI will exhibit its back-end inspection solutions, including the 3D SEMI AOI TR7900Q SII and TR7700Q SII-S with AI-Powered 3D Inspection that can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The TR7900Q SII fully integrates with the loader/unloader module to ease the handling of strips and magazines. TRI will also exhibit the back-end inspection solutions, the TR7007Q SII-S for C4 bumps (~100 μm Ø), Mini-LED, and 008004 paste inspection applications. The lineup will also include an X-ray Inspection Demo Station. TRI's SEMI AXI solutions can inspect C4 bumps, Cu pillars, TGV, and more.
