SH-5 Test Chip Packaging Deal
Atlantic Technology boasts expertise with advanced packaging techniques and a fast turnaround for assembly and test of prototype devices. The packaging company has capacity for production of more than 15mn units per month.
The SH-5 64-bit general purpose CPU is designed for high performance multimedia applications. The 64-bit architecture delivers comparable performance to digital signal processors (DSP) through its floating point unit (FPU) and single instruction-stream, multiple data-stream (SIMD) capabilities. Licensees use the SH-5 in a range of applications from blade servers to graphics engines.
The test chip integrates peripherals including SDRAM and Flash memory interfaces, UART, timers and a 32-bit PCI bridge. Silicon for the SH-5 test chip is being manufactured by TSMC in Taiwan in a 0.13micron CMOS process.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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