German electronic design automation (EDA) developer Keil and French intellectual property supplier DOLPHIN Integration have jointly developed a hardware/software (HW/SW) coverification platform aimed at system designs involving mixed-signal system chips (SoC), micro-electro-mechanical systems (MEMS) and 8051 processors.

German electronic design automation (EDA) developer Keil and French intellectual property supplier DOLPHIN Integration have jointly developed a hardware/software (HW/SW) coverification platform aimed at system designs involving mixed-signal system chips (SoC), micro-electro-mechanical systems (MEMS) and 8051 processors.

The companies linked Keil's microVision2 integrated development environment (IDE) together with the multi-level mixed signal simulator SMASH, the result being known as "SUCCESS".

SUCCESS has been first developed for Dolphin's Flip8051 family of virtual components. The Flip8051 family has eight options with various architectures, optimised either for speed or density. Dolphin has also developed Flip80251 - an accelerated version of the 80C251, which is the 16-bit extension of the legacy 80C51 processor developed by Intel and already supported by Keil.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

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We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

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