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Optical

ULM-photonics is sampling its new 850nm Transsub VCSEL laser that operates at 3.125Gbit/sec.

The GaAs VCSEL was grown as a bottom emitter with topside
P and N contacts.


The technology offers a VCSEL for direct flip chip packaging having a
mechanically robust surface on the emitting side and contacts on the
opposite side similar to a surface mount device (SMD). This design
accommodates features for integrating lenses and fibre alignment marks by
stacking additional wafers. Fibres or connectors may even touch the glass
surface of the VCSEL without influencing the performance and lifetime.


The company estimates that two years ago the cost ratio of VCSEL chip to
package was in the range of 1:1. This ratio is now approaching 1:4. The
companys response has been to develop functional integration of emitter,
coupling and fibre alignment. The Transsub VCSEL enables integration of such
functions at the wafer scale, allowing a full testable optical subassembly
before singulating single lasers or arrays.


Targeted applications are low cost very short reach interconnects as well as
automotive datacom.



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