Optical
The GaAs VCSEL was grown as a bottom emitter with topside
P and N contacts.
The technology offers a VCSEL for direct flip chip packaging having a
mechanically robust surface on the emitting side and contacts on the
opposite side similar to a surface mount device (SMD). This design
accommodates features for integrating lenses and fibre alignment marks by
stacking additional wafers. Fibres or connectors may even touch the glass
surface of the VCSEL without influencing the performance and lifetime.
The company estimates that two years ago the cost ratio of VCSEL chip to
package was in the range of 1:1. This ratio is now approaching 1:4. The
companys response has been to develop functional integration of emitter,
coupling and fibre alignment. The Transsub VCSEL enables integration of such
functions at the wafer scale, allowing a full testable optical subassembly
before singulating single lasers or arrays.
Targeted applications are low cost very short reach interconnects as well as
automotive datacom.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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