Info
Info
News Article

TI Plans Second 300mm Fab

Texas Instruments plans to be groundbreaking a new 300mm fab by the end of 2005 in Richardson, Texas.

This will be the second 300mm TI plant - the
first being DMOS 6 in Dallas that has been in operation since 2001. The
RIchardson facility will represent an investment of $3bn by TI over a
multi-year period subsequent to groundbreaking. When fully operational, the
fab is expected to employ up to 1000 people. The project will need
appropriate permits and incentives as well as market demand to proceed. The
facility would produce digital signal processing (DSP) and analogue-based
system-on-chip (SoC) devices for wireless, broadband and digital consumer
applications.



TI's construction plan involves erecting the building and infrastructure
ahead of market demand, followed by stages of equipment installation as
demand increases. This construction method spreads capital investment over a
period of years and allows the company to increase production quickly as
customers demand more products.



Two other US states and an overseas location competed against Texas to be
the new TI site for 300mm production.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
New Plant To Manufacture Graphene Electronics
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
AP&S Expands Management At Beginning Of 2021
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
DISCO's Completion Of New Building At Nagano Works Chino Plant
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
K-Space Offers A New Accessory For Their In Situ Metrology Tools
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
TEL Introduces Episode UL As The Next Generation Etch Platform
Changes In The Management Board Of 3D-Micromac AG
Will Future Soldiers Be Made Of Semiconductor?
ITRI And DuPont Inaugurate Semiconductor Materials Lab
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
Onto Innovation Announces New Inspection Platform
EV Group Establishes State-of-the-art Customer Training Facility
Cadence Announces $5M Endowment To Advance Research
Panasonic Microelectronics Web Seminar
ASML Reports €14.0 Billion Net Sales
SUSS MicroTec Opens New Production Facility In Taiwan
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event