Cool Chips and Rolls-Royce have signed a term sheet with a view to a license agreement that would give Rolls-Royce exclusive, worldwide rights to use Cool Chips’ solid-state cooling technology.

Cool Chips and Rolls-Royce have signed a term sheet with a view to a license agreement that would give Rolls-Royce exclusive, worldwide rights to use Cool Chips' solid-state cooling technology.

If Rolls-Royce were to take out the option to license, it would cover specific applications across the company's range of gas turbine products for the civil aerospace, defence, marine and energy markets and for specific applications across electrical transmission, conditioning, and distribution applications.

Cool Chips products are wafer-like discs using quantum mechanical electron tunnelling as a cooling mechanism. The devices are designed to produce cooling or refrigeration more efficiently than any competing technology, while weighing less than 10% of an equivalent compressor-based system.

Peter Cowley, Rolls-Royce chief scientist, comments: "Rolls-Royce is committed to investment in emerging technologies as part of a continuous program for the improvement of efficiency, noise reduction and the lowering of emissions. We are very interested in the potential of Cool Chips.

"If Cool Chips is able to deliver what it promises, this technology will revolutionise our electronic heat management systems - for example in our control electronics and for the power electronics that are increasingly used to distribute power around aircraft and ships."

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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