Alliances
The manufacturing
agreement includes Infineon's OptiMOS technology with potential extension to
its CoolMOS process.
These processes are used to manufacture power MOSFETs with computer,
communications, consumer, industrial and automotive applications. The
OptiMOS process fits within the tooling capabilities of Chartered's Fab 2,
but involves significantly fewer masking layers than a typical CMOS process
flow. The price per wafer is accordingly lower than for usual CMOS products
run in Fab 2.
As part of its capacity extension plans, Infineon will initially transfer
its OptiMOS technology process to Fab 2 with qualification due by the end of
2003. Volume production is scheduled to ramp in 2004. As part of the
agreement, Chartered will also supply non-OptiMOS technologies to Infineon.
Feinfocus has expanded its membership with the Advanced Packaging &
Interconnect Alliance (ApiA) in order to investigate the importance of x-ray
inspection as the semiconductor industry shifts towards wafer-level and
system-on-chip packaging. The company believes that nanofocus and
nanotomography inspection criteria will become more vital as a result of
these wafer technology trends. Feinfocus will collaborate with other APiA
members on x-ray inspection technology.
The APiA is an alliance of equipment suppliers and process developers in the
advanced packaging and interconnect industries.
The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) says
it has successfully installed a 300 mm wafer bumping and wafer-level
packaging (WLP) line at Unitive Semiconductor Taiwan (UST). The installed
integrated process equipment from the SECAP member companies will be used
for high-volume manufacturing. This is claimed as the first fully integrated
300mm electroplated wafer bumping line installed at a wafer level packaging
service provider for immediate high-volume production.
SECAP and Unitive agreed to install the 300mm wafer bumping line in July
2002. With the SECAP process installation complete, the 300mm line is now
available to customers and prospective customers of SECAP member companies
for equipment demonstrations and processing evaluation.
The SECAP line enables member companies to further optimise their equipment
for the integrated process flow of typical wafer bumping lines. SECAP is
neutral to all packaging technologies and welcomes the opportunity to work
with all manufactures. SECAP members provide process support, but do not
sell or license process technology. The consortium consists of Semitool,
Suss MicroTec, Image Technology, Matrix Integrated Systems, NEXX Systems,
EKRA, BTU International and the Frauhofer Institute for Reliability and
Microintegration (IZM).
Japanese company Asahi Glass and International Sematech agreed to
collaborate on developing advanced mask technology and materials for use in
EUV lithography.
Besides providing ISMT with advanced mask materials, Asahi also will send
scientists to work with ISMT technologists at the consortium's advanced R&D
facility at the University at Albany, New York.
Asahi's interest in advanced materials for mask applications started with
the development of modified fused silica substrate and hard and soft
pellicle materials for 157nm lithography several years ago.
Asahi Glass will use ISMT's tools at UAlbany to further technology
development for their own commercial manufacturing efforts. Earlier this
year, ISMT entered into a five-year strategic alliance with UAlbany to
develop EUV infrastructure for industry needs in 2007. The programme focuses
on defect-free masks and special resists.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
REGISTER FOR FREE
VIEW SESSIONS
