Intellectual Property
Toshiba and Elpida expect to begin shipping XDR DRAM in
2004, ramping to volume production in 2005. Sony Corporation and Sony
Computer Entertainment licensed the XDR memory interface for future
broadband applications earlier this year.
XDR DRAM uses Rambus' XDR memory interface, formerly code-named Yellowstone.
Running at 3.2GHz, XDR DRAM offers 8x the bandwidth of today's best-in-class
PC memory.
XDR DRAM is expected to initially serve the high-bandwidth needs of
consumer, graphics and networking applications, with eventual applicability
for PC main memory, server and mobile systems.
The companies claim that XDR DRAM offers significant cost savings by
providing the same system bandwidth as alternatives with fewer DRAM
components, low-cost 4-layer PCBs and inexpensive industry-standard
packages. Cost has been a major Achilles heel for adoption of previous
Rambus technology.
Initially XDR DRAM will be offered at 3.2GHz with a roadmap to 6.4GHz and
beyond. The top figure would enable memory system bandwidths up to
100GBytes/sec. XDR DRAM will be available in densities ranging from 256Mbits
to 8Gbits, and device widths ranging from x1 to x32.
XDR has a "matrix topology" allowing point-to-point differential data
interconnects to scale to multi-GHz speeds. Bussed address and command
signals allow a scalable range of memory system capacity supporting from one
to 36 DRAM devices.
The XDR infrastructure - DRAM models, controller IO cells, clock generators,
data sheets and system design guides - are available today for semiconductor
and system design.
Cool Chips and Rolls-Royce have signed a term sheet with a view to a license
agreement that would give Rolls-Royce exclusive, worldwide rights to use
Cool Chips' solid-state cooling technology. If Rolls-Royce were to take out
the option to license, it would cover specific applications across the
company's range of gas turbine products for the civil aerospace, defence,
marine and energy markets and for specific applications across electrical
transmission, conditioning, and distribution applications.
Cool Chips products are wafer-like discs using quantum mechanical electron
tunnelling as a cooling mechanism. The devices are designed to produce
cooling or refrigeration more efficiently than any competing technology,
while weighing less than 10% of an equivalent compressor-based system
Peter Cowley, Rolls-Royce chief scientist, comments: "Rolls-Royce is
committed to investment in emerging technologies as part of a continuous
program for the improvement of efficiency, noise reduction and the lowering
of emissions. We are very interested in the potential of Cool Chips.
"If Cool Chips is able to deliver what it promises, this technology will
revolutionise our electronic heat management systems - for example in our
control electronics and for the power electronics that are increasingly used
to distribute power around aircraft and ships."
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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