Vorwerk Teppichwerke's carpet production plant in Hameln, Germany, has signed a co-operation agreement with Infineon Technologies concerning carpets with woven-in "intelligence". The two companies are joining forces on the development of a marketable solution and plan to present initial prototypes by the end of 2004.

Vorwerk Teppichwerke's carpet production plant in Hameln, Germany, has
signed a co-operation agreement with Infineon Technologies concerning
carpets with woven-in "intelligence". The two companies are joining forces
on the development of a marketable solution and plan to present initial
prototypes by the end of 2004.
In May of this year, Infineon presented the concept for the integration of
microelectronics in textile surfaces, which makes it possible to create
floor coverings with a self-organising network of robust chips (Bulletin
482, May 8, 2003). Vorwerk is the first partner from the textile industry to
work with Infineon to further develop the idea.
The technology can be used to embed sensor functions, such as monitors for
pressure, temperature or vibration, directly into woven fabric materials.

This permits the use of the intelligent fabrics as motion or fire sensors or
for the control of air-conditioning and alarm systems. Woven-in
light-emitting diodes (LEDs) can also convert the textiles into versatile
signs or advertising media.

Dr. Werner Weber from the emerging technology research department at
Infineon reports: "We will now engage in a joint research project to create
initial functional demonstrators, which are then bound to find their way
from the lab into textile production as quickly as possible."

The Vorwerk group has 46,400 employees and expert advisors in more than 50
countries providing high-end household appliances.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS