Protein Analysis On Silicon
The surface of this particle can be configured with many different capture proteins. The nanoparticle diameter is less than 0.1micron. These particles are then deposited on silicon carriers in thin, even layers.
After contact is made with a sample, the chips can be analysed using matrix assisted laser desorption ionisation - time of flight (MALDI-TOF) mass spectrometry. Knowing the masses of the bound proteins provides a direct indication of their identity. Previously, MALDI-TOF mass spectrometry samples had to be prepared for measurement in a multi-stage process.
"Our nanoparticles enable us for the first time to directly enrich and measure the proteins," says scientist Dr. Guenter Tovar, head of the Fraunhofer IGB Biomimetic Interfaces research group. The nanoparticles also enable greater sensitivity.
The nanoparticle protein chips will initially serve as a research tool, but in the future their use as diagnosis chips for the early detection of illnesses is hoped for.
The project also involves workers from the universities of Giessen, Goettingen, Tuebingen and Stuttgart (Institute for Interfacial Engineering IGVT). The companies BioCore and ThermoFinnigan MAT also contributed. Funding came from the German Federal Ministry of Education and Research (BMBF).
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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