Sales & Orders
Luciano Gandolfi, vice-president of front-end manufacturing at ST, reports
on the equipment's use: "Limiting particulate contamination has always been
a challenge of SOG annealing. We previously monitored for particles and SOG
shrinkage on a daily basis, but now we do it only once a week." Gandolfi
adds: "We are achieving 99.8% uptime with the SAO-150, and this represents a
significant cost saving both in consumable parts and in maintenance."
The SAO-150AP system is a resistance heated, stacked hotplate oven for low
temperature baking, curing, and annealing of semiconductor materials at
atmospheric pressure and temperatures up to 500C. The system can process
five wafers simultaneously. Throughput is 40 wafers per hour for a 5-minute
process.
The SAO does not use any process gas, compressed air, or cooling water, and
average power consumption is 3kW at 400C. There are no o-rings to replace,
no pneumatic valves and nothing to clean in the process chamber.
After nearly three year of installations into 150mm, 200mm and 300mm volume
production fabs, WaferMasters reports uptimes of greater than 99% and mean
times between failure (MTBF) of more than 2500 hours for the tool. Other
applications include low-k dielectric annealing, polyamide bake, SiLK
annealing, Cu annealing, NiSi annealing, Al sintering and photoresist
bake/reflow.
ChipMOS Technologies reports on agreements signed in March with Mitsubishi
Electric to provide assembly and test services. The agreements were
consented to by the Renesas Technology joint venture set up between
Mitsubishi and Hitachi. One order concerns wafer test of mobile/handheld
memory devices. The wafers will be tested on ChipMOS' T5371 Advantest
equipment. Another order is for IC assembly and test of low-power memory.
These ICs will be packaged in ChipMOS' TSOP package solution. The end use of
these ICs is mainly for graphic applications.
Genus announced multiple orders for its StrataGem200 atomic layer deposition
(ALD) tool from a major European DRAM manufacturer.
This order marks the second DRAM maker to put Genus ALD tools into
production. The DRAM maker will implement the ALD technology into 200mm
production at the 90nm node.
"This is the first customer to adopt ALD for 90nm production," reports Genus
CEO Bill Elder.
At the 110nm node, ALD has been used on DRAM production lines for capacitor
applications because of its ability to deposit advanced high-k dielectrics.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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