Hynix Semiconductor has completed development of its 1Gbit DDR2 memory chip. Sampling will begin in early 4Q 2003 with full-scale volume production coming on-line by early 2004 to coincide with the release of Intel's DDR2 supporting PC chipset.

Hynix will use its Golden Chip 0.11micron process
technology. A 512Mbit DDR2 chip will also be available.
Golden Chip was designed to use existing equipment as far as possible,
lowering introduction costs. The company estimates that use of its
0.11micron technology will reduce overall investment requirements by 50%
compared with its competitors and will increase the number of die per wafer
by 40% in comparison with its 0.13micron Prime Chip technology.

Irvine Sensors plans to start production of a ball grid array (BGA) package
containing two stacked Micron 256Mbit SDRAM Double Data Rate (DDR) 333MHz
parts available for deliveries from September 2003. A product consisting of
stacked Samsung DDR parts is planned for release in the subsequent quarter.
These are expected to be the first of a family of stacked BGA parts that
takes advantage of Irvine's own patented stacked package technology.
Potential customers are being invited to submit requests for quotation on
stacks of any commercially available BGA packages. Irvine Sensors has an
existing line of more than two dozen different stacked TSOP packages.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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