austriamicrosystems has won a multi-$mn contract to design and supply an embedded processor with ultra low-power analogue ICs from Philips Oral Healthcare, a subsidiary of Philips. The application specific integrated circuit (ASIC) will be used in Philips Oral Healthcare’s next generation of Sonicare toothbrush.

austriamicrosystems has won a multi-$mn contract to design and supply an embedded processor with ultra low-power analogue ICs from Philips Oral Healthcare, a subsidiary of Philips. The application specific integrated circuit (ASIC) will be used in Philips Oral Healthcare's next generation of Sonicare toothbrush.

Austriamicrosystems will be using its mixed-signal integration capabilities in microprocessor and low power analogue design on the same die. Second source production will be available through austriamicrosystems' foundry process partner TSMC.

Austriamicrosystems believes it owes its success in the medical and consumer industry to its ultra low power mixed signal designs. These sectors see increased battery life as a key performance criterion. The chip company has devices used in a broad range of other battery powered devices such as glucose meters, inhalers, heart rate monitors, cell phones and PDAs.

Philips' Sonicare range uses a patented sonic technology with a high-speed bristle motion and a dynamic fluid cleaning action.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

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