Angry Workers Walk-out On ST
In particular, the company will withdraw from its 150mm fab in Rennes, France. Some 150mm activity will be transferred to ST's 200mm fab at Rousset near Aix en Provence. The company's specialised discrete-components activity at Tours will continue.
The Rennes site employs 428 people under permanent contract. Some 34 of these employees are scheduled to take early retirement. The facility is ST's smallest 150mm production unit. The company says that its location within the city of Rennes prevents the site from expanding to accommodate 200mm or 300mm technology.
In November 2001, a committee was set up to identify potential new activities for the site. The committee examined a project to convert the site to new technologies, such as MEMS (micro-electro-mechanical systems), or to establish research and development activities. However, the MEMS market is highly competitive, represents limited volumes and accounts for only about 1% of the global semiconductor market. R&D activities alone would not be enough to sustain the site.
ST's management then initiated efforts to attract other companies to the Rennes site with the aim of maintaining industrial activity there. These efforts will continue. In the meantime, production will be run down at the Rennes site, before stopping completely at the end of March 2004. The activity of assembling and testing components for the space industry, which cannot continue alone at the Rennes site, will be transferred to another ST site in Europe.
As a result of the walk out, the company has sent the plan to each representative by mail.
The company says that rapid changes - characterised by replacement of mature 150mm technology - has prompted the need for the plan. The older 150mm production has become increasingly exposed to competition. Newer facilities use 200mm and 300mm wafers. Further, many of ST's customers have shifted production to Asia.
ST says it will offer jobs at its other sites in France to all Rennes employees, at equivalent professional conditions. Currently ST has 384 permanent positions that need to be filled in France. The transfers would be accompanied by an incentive package including relocation and training. ST is also willing to help workers find jobs outside the company. In addition, early retirement programmes are foreseen.
Tours is not considered to be subject to the same 150mm wafer competitive circumstances as Rennes. The Rousset site is ST's main location for providing integrated circuits for microcontroller-based smartcards.
The current inventory of ST fabs in France is single 150mm fabs located at Rennes and Tours, 150mm and 200mm fabs at Rousset and 200mm and 300mm fabs at Crolles, near Grenoble. The 300mm Crolles2 facility is a partnership with Motorola and Philips.

AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
REGISTER FOR FREE
VIEW SESSIONS