The Fraunhofer Institute site in Itzehoe, Germany, will be using SUSS MicroTec’s SB6e 150mm substrate bonder to develop commercially viable micro-electro-mechanical system (MEMS) applications.

The Fraunhofer Institute site in Itzehoe, Germany, will be using SUSS MicroTec's SB6e 150mm substrate bonder to develop commercially viable micro-electro-mechanical system (MEMS) applications.

One of the largest costs associated with bringing MEMS to market is device packaging. Traditionally, each die is packaged individually. In certain applications, packaging represents up to 90% of the total cost of the device. By using the SB6e to develop more cost-effective wafer-level packaging processes for MEMS, the Fraunhofer Institute expects to lower device costs, thereby increasing MEMS marketability. These processes are being developed in conjunction with MELODICT - a European Union project focused on the commercial development of RF-MEMS transceivers for wireless communications.

Although the SB6e is designed for a laboratory environment, it enables processes to be easily transferred to volume production because it shares key components with SUSS' volume-production bonders such as the ABS150e and ABS200.

To meet the need for controlled atmospheric conditions in MEMS packaging, the Fraunhofer has developed a fluxless, lead-free (Pb-free) solder bonding process for wafer-level encapsulation of the microstructure. For the wafer-to-wafer bonding involved in this process, the SUSS SB6e in combination with the SUSS BA6 bond aligner has been successfully used. The SUSS bonder enabled thermo-compression bonding and showed good wetting, homogenous bonding, high bonding strength and hermetic sealing.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

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We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

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