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Carl Zeiss Delivers 157nm Tool To SEMATECH

Carl Zeiss Microelectronic Systems has delivered its first Aerial Image Measurement System (AIMS) for 157nm optical lithography to International SEMATECH (ISMT) in Austin, Texas. The tool is to be used to develop cutting-edge 157nm photomask technology.
Carl Zeiss Microelectronic Systems has delivered its first Aerial Image Measurement System (AIMS) for 157nm optical lithography to International SEMATECH (ISMT) in Austin, Texas. The tool is to be used to develop cutting-edge 157nm photomask technology.


The system emulates the wafer printing characteristics of photomasks during optical lithography for development, quality control, repair, verification and defect classification. The development of the production-worthy AIMS fab 157 system was strongly supported by two major industry consortia - namely, International SEMATECH and SELETE in Japan.


Specific exposure tool conditions can be characterised based on quantities such as numerical aperture (NA), partial illumination coherence (Sigma) and the particular type of illumination (annular, dipole, quadrupole). By adjustment of these quantities within the AIMS tool, the operating conditions are exactly matched to the individual exposure conditions of the 157nm stepper or scanner. Rapid prediction of mask defect printability is obtained without the need for physical wafer exposures.


The International SEMATECH tool will undergo extensive beta testing over the next months in collaboration with multiple leading-edge mask and IC manufacturers. Additional AIMS fab 157 systems are currently in final production and will be delivered to end customers within the coming months.



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