Carl Zeiss Delivers 157nm Tool To SEMATECH
The system emulates the wafer printing characteristics of photomasks during optical lithography for development, quality control, repair, verification and defect classification. The development of the production-worthy AIMS fab 157 system was strongly supported by two major industry consortia - namely, International SEMATECH and SELETE in Japan.
Specific exposure tool conditions can be characterised based on quantities such as numerical aperture (NA), partial illumination coherence (Sigma) and the particular type of illumination (annular, dipole, quadrupole). By adjustment of these quantities within the AIMS tool, the operating conditions are exactly matched to the individual exposure conditions of the 157nm stepper or scanner. Rapid prediction of mask defect printability is obtained without the need for physical wafer exposures.
The International SEMATECH tool will undergo extensive beta testing over the next months in collaboration with multiple leading-edge mask and IC manufacturers. Additional AIMS fab 157 systems are currently in final production and will be delivered to end customers within the coming months.
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Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
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Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
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