Infineon, Intel, Philips, Samsung Electronics and STMicroelectronics have joined IMEC’s new sub-45nm research platform as "core partners". IMEC has a target of eight to ten core partners in all. The work will involve use of IMEC’s 300mm "research foundry" facility currently under construction.

Infineon, Intel, Philips, Samsung Electronics and STMicroelectronics have joined IMEC's new sub-45nm research platform as "core partners". IMEC has a target of eight to ten core partners in all. The work will involve use of IMEC's 300mm "research foundry" facility currently under construction.

IMEC's collaborative research programme targets technology generations two to three nodes ahead of state-of-the-art IC production. The central focus in these programmes is on advanced process module and device research, with several programmes being devoted to the exploration of new materials.

Programmes include advanced lithography, cleaning and contamination control, substrate modules (implementation of high-mobility layers and advanced source/drain engineering solutions), gate stack (high-k dielectrics and metal gates), alternative CMOS devices (SOI and multi-gate FETs), germanium-based CMOS devices and advanced interconnect solutions (ultra-low-k materials and wafer-level packaging on Cu damascene wires).

The tool set for the execution of these programmes will gradually transition from 200mm to 300mm wafers in IMEC's new research facility, which will be ready for equipment installation in Spring 2004. Partnerships with several leading equipment manufacturers have been concluded by the signing of agreements to deliver the latest process tools. A strategic alliance has been made with ASML to provide advanced lithography clusters.

Core partner benefits include increased involvement in the steering and execution of the research programmes, a favourable intellectual property ruling and an early insight to breakthrough research results. The partners also have access to all the programmes allowing them to obtain a full picture of the research status of sub-45nm technologies and to gain fundamental understanding in each area.

Other semiconductor companies such as Texas Instruments are also participating in a large number of programmes.

Professor Gilbert Declerck, president and CEO of IMEC, comments: "These agreements are proof of our ability to bring together the leading semiconductor manufacturers, material and equipment suppliers. We are confident that more key players will join us and further extend our programmes with worldwide competencies."

Dr Paolo Gargini, Intel's director of Technology Strategy and Intel Fellow, says: "We believe that IMEC is indeed one of the world's centres of excellence in its field. Intel has been an active participant in IMEC programmes for many years and has benefited as a result. We believe that the new 300mm cleanroom - hosting programmes aimed at features of 45nm and below - will further enhance the value of the contributions from IMEC. We now feel confident that we will get maximum value by becoming a core partner together with some of the leading IC companies in the world."

Joel Monnier, corporate vice president and director of Central R&D at STMicroelectronics, reports: "In conjunction with ST's well- established and long-term co-operation with its strategic research partner LETI, the Crolles2 Alliance partners will now have access to the most efficient advanced R&D in Europe and the US."

Crolles2 in France involves ST, Philips and Motorola with the Taiwan foundry TSMC also participating.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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