Info
Info
News Article

Redesign Of NXP Semiconductors Organisation

News
The restructuring targets US$ 550 million annual cost savings and fab closures in Fishkill (US), Hamburg (Germany), Nijmegen (Netherlands) and Caen (France) are planned.
NXP Semiconductors (formerly Philips Semiconductors) announced a redesign programme that will bring NXP to a healthy financial situation and position the company for future growth. The changes come in response to a challenging economic environment, a weak US dollar, and the reduction in size of the company after moving its wireless business into a joint venture with STMicroelectronics. The redesign programme includes major reduction of NXP's manufacturing base, its central R&D, and support functions. This programme is expected to affect approximately 4,500 people globally and will result in annualised savings of USD 550 million. The restructuring cost will result in an estimated cash out of USD 800 million.

As a result four factories are planned to be sold or closed. The fab in Fishkill, New York, USA will be closed ultimately in 2009. Additionally, two other factories are planned to be closed by 2010: the “ICN5” part of the NXP facility in Nijmegen, Netherlands, and part of the “ICH” fab of the Hamburg facility, Germany. NXP's fab in Caen, France will be put on the market for sale. The company is open to offers for this facility from prospective buyers, however, in the event that a buyer is not found the facility could be closed as well during 2009. This plan targets to increase the loading in the remaining fabs to over 90 percent, as well as result in expected savings of USD 300 million on a run rate basis by the end of 2010. Details will be confirmed in discussions with NXP customers as the company plans for the seamless transition of the production and are subject to consultations with unions and employee representatives.

The redesign programme of NXP's R&D and support functions reflects the ambition to have a more balanced global cost base and reduced and more focused central R&D. NXP has matched the requirements of its core businesses to its R&D and support resources and as a result can effectively serve its customer needs at much lower operating expense levels. These planned changes are expected to affect employees primarily in the Netherlands, France and Germany. After the restructuring NXP will invest 16 to 17% of sales in R&D, which is in line with leading semiconductors companies.

Moving forward, NXP will focus on its Automotive, Identification, Home, and MultiMarket businesses where it has a high share of innovative products and market leadership positions. The redesign measures will establish NXP with a strong base to achieve its midterm targets to deliver profitable growth with 15% EBITA and positive cash flow.

Commenting on the redesign plans NXP Chief Executive Officer Frans van Houten said, “This restructuring is a tough measure and it is regrettable that we need to let people go. However, the changes will make NXP a strong, profitable and growing company, with a positive cash flow. NXP is transforming into a globally competitive semiconductor company with scale and leadership in its core businesses. Measures include increasing the competitiveness of our manufacturing base and reduction in our work force, resulting in a leaner, customer focused company, well positioned for growth in our core businesses.”

Changes to the manufacturing operations reflect NXP's long term asset light strategy, the need for a balanced geographical cost base and commitment to ongoing customer programs. The programme entails the migration to more advanced production processes, reduction of excess capacity in older technologies, together ensuring a much more competitive operation, while maintaining a strong manufacturing presence in Europe. NXP plans to consolidate the majority of its production to two higher capability European fabs: Nijmegen and Hamburg, and to SSMC in Singapore.

The changes will lead to a reduction in annual operating expenses of USD 250 million and are expected to be implemented mostly during 2009. Further details will be communicated on a local country basis as part of the consultation process with employee representatives and unions.

NXP will do its utmost to redeploy affected employees into different positions, but sees redundancies as inevitable. The company has initiated consultations with unions and employee representatives with regard to the implications and implementation of the proposed measures. NXP plans to implement these measures between now and 2010.


AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
SUSS MicroTec Opens New Production Facility In Taiwan
K-Space Offers A New Accessory For Their In Situ Metrology Tools
ITRI And DuPont Inaugurate Semiconductor Materials Lab
Will Future Soldiers Be Made Of Semiconductor?
AP&S Expands Management At Beginning Of 2021
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
TEL Introduces Episode UL As The Next Generation Etch Platform
Panasonic Microelectronics Web Seminar
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
DISCO's Completion Of New Building At Nagano Works Chino Plant
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
ASML Reports €14.0 Billion Net Sales
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
EV Group Establishes State-of-the-art Customer Training Facility
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
New Plant To Manufacture Graphene Electronics
Onto Innovation Announces New Inspection Platform
Changes In The Management Board Of 3D-Micromac AG
Cadence Announces $5M Endowment To Advance Research

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event