News Article
Intevac announces semiconductor capital equipment business alliance
Both companies joined to strengthen their manufacturing, technology and geographical position.
Intevac and TES announced they have entered into a semiconductor capital equipment business alliance. Intevac, with headquarters in Santa Clara, California, is a provider of magnetic media deposition systems and recently developed a system for dielectric etch applications. TES is a Korean manufacturer of chemical vapour deposition (CVD) systems, as well as other products. The two companies have joined forces to leverage each party’s technology, manufacturing and geographic strengths in order to accelerate sales of their semiconductor products.
This alliance covers product development, manufacturing and sales of Intevac’s dielectric etch and TES’ CVD semiconductor equipment products. The terms of the agreement provide exclusive rights to TES to sell and build Intevac’s etch system for the Korean and Chinese markets, while Intevac has exclusive rights to sell and build TES’ CVD systems for customers throughout the rest of the world. The two companies will work together to optimise operational performance and jointly develop future products.
“There is a strong desire in Korea to cultivate and support local capital equipment companies. TES’ close proximity to the major Korean semiconductor companies, along with their excellent reputation in supporting them, can help us accelerate Lean Etch sales,” said Kevin Fairbairn, president and chief executive officer of Intevac.
“The alliance business model will enable both companies to reduce manufacturing costs and operating expenses while enabling us to offer a wider portfolio of products to our customers. Intevac will now be able to offer CVD systems in our served markets earlier, and at reduced development costs, than previously planned,” Mr. Fairbairn continued. “This business model is a groundbreaking approach to serving the global semiconductor industry.”
“We are very pleased with our alliance with Intevac,” said Shoong Ehl Ju, president and chief executive officer of TES. “By being able to offer Intevac’s Lean Etch system along with our own CVD systems in Korea and China, we will expand and strengthen our business,” he explained. “In addition, this alliance will allow us to offer competitive products utilising the combined technical resources of both companies. We will improve our CVD product through the integration of Intevac’s high productivity Lean mainframe, reduce our manufacturing costs and jointly create future products,” Mr. Ju concluded.
This alliance covers product development, manufacturing and sales of Intevac’s dielectric etch and TES’ CVD semiconductor equipment products. The terms of the agreement provide exclusive rights to TES to sell and build Intevac’s etch system for the Korean and Chinese markets, while Intevac has exclusive rights to sell and build TES’ CVD systems for customers throughout the rest of the world. The two companies will work together to optimise operational performance and jointly develop future products.
“There is a strong desire in Korea to cultivate and support local capital equipment companies. TES’ close proximity to the major Korean semiconductor companies, along with their excellent reputation in supporting them, can help us accelerate Lean Etch sales,” said Kevin Fairbairn, president and chief executive officer of Intevac.
“The alliance business model will enable both companies to reduce manufacturing costs and operating expenses while enabling us to offer a wider portfolio of products to our customers. Intevac will now be able to offer CVD systems in our served markets earlier, and at reduced development costs, than previously planned,” Mr. Fairbairn continued. “This business model is a groundbreaking approach to serving the global semiconductor industry.”
“We are very pleased with our alliance with Intevac,” said Shoong Ehl Ju, president and chief executive officer of TES. “By being able to offer Intevac’s Lean Etch system along with our own CVD systems in Korea and China, we will expand and strengthen our business,” he explained. “In addition, this alliance will allow us to offer competitive products utilising the combined technical resources of both companies. We will improve our CVD product through the integration of Intevac’s high productivity Lean mainframe, reduce our manufacturing costs and jointly create future products,” Mr. Ju concluded.
