News Article
SUSS MicroTec announces ISO 9001:2000 certification
The bonder division of Vermont based SUSS MicroTec now holds ISO certification.
SUSS MicroTec., a supplier for process and test solutions for the semiconductor industry announces that SUSS MicroTec, manufacturer and supplier of production and process wafer bonding systems, now holds the globally recognised ISO 9001 certification for having established a high level process and system oriented quality management (QM) based on ISO 9001 standards. Proceeding the ISO certification of SUSS MicroTec Lithography in 2007, another division of the SUSS MicroTec group has been certified for international quality standards. This is in line with ongoing efforts to increase efficiency and alignment within the SUSS MicroTec group.
SUSS MicroTec, based in Vermont, is the bonder division headquarters and North American sales and service site for all SUSS products. The fastest growing division of the SUSS MicroTec group, the bonder division develops and manufactures wafer bonders for high volume MEMS and semiconductor markets.
The ISO 9000 series of standards represents an international consensus of quality management practices. Providing a consistent set of criteria for the development and acceptance of corrective action and responses is a part of the audit process. This has assisted SUSS MicroTec in their drive to managing their manufacturing process effectively and giving customers continued confidence. The ISO certification validates the effectiveness and strength of SUSS MicroTec’s quality management systems as well as their assurance of continuous improvement.
“Achieving ISO 9001-2000 certification reflects our dedication and ongoing commitment.”, said Wilfried Bair, VP Business Development and General Manager, bonder division, ”It shows our customers that we are producing leading edge and top quality wafer processing equipment covering all steps from design and development, to manufacturing, installation and after sales support.”
SUSS MicroTec, based in Vermont, is the bonder division headquarters and North American sales and service site for all SUSS products. The fastest growing division of the SUSS MicroTec group, the bonder division develops and manufactures wafer bonders for high volume MEMS and semiconductor markets.
The ISO 9000 series of standards represents an international consensus of quality management practices. Providing a consistent set of criteria for the development and acceptance of corrective action and responses is a part of the audit process. This has assisted SUSS MicroTec in their drive to managing their manufacturing process effectively and giving customers continued confidence. The ISO certification validates the effectiveness and strength of SUSS MicroTec’s quality management systems as well as their assurance of continuous improvement.
“Achieving ISO 9001-2000 certification reflects our dedication and ongoing commitment.”, said Wilfried Bair, VP Business Development and General Manager, bonder division, ”It shows our customers that we are producing leading edge and top quality wafer processing equipment covering all steps from design and development, to manufacturing, installation and after sales support.”
