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ASML reveals progress in EUV lithography programme

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The company updates the industry on significant progress in EUV lithography and reveals the roadmap that extends semiconductor manufacturing to 11 nanometres and beyond.
ASML Holding (ASML) presents at the 2008 International Symposium on Extreme Ultraviolet Lithography (EUV) on recent achievements in its EUV lithography programme and unveils a production system roadmap that supports cost effective chip manufacturing to at least 11 nanometres (nm).

The NXE series of lithography machines will be built on an evolved TWINSCAN platform. Design of the first production system is complete, the supply chain is fully engaged and system manufacturing has started. ASML currently has orders for five of these systems from memory and logic customers on three continents.

“EUV lithography remains the most attractive option for extending Moore’s Law,” stated Martin van den Brink, ASML’s executive vice president of marketing and technology. “As a single exposure, multi node technology, EUV offers the greatest extendibility at the lowest cost of ownership.”

NXE production systems are the result of the learning and infrastructure development made possible by ASML EUV Alpha Demo Tools (ADT). In August 2006 ASML shipped the industry’s first full field EUV exposure tools. One EUV ADT was installed at IMEC in Leuven, Belgium and another at CNSE in Albany, New York, USA.
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