News Article
Advanced collaboration on green LEDs
IMEC and Taiyo Nippon Sanso collaborate on green LED manufacturing technology.
Taiyo Nippon Sanso (TNSC), a total solution provider in the compound semiconductor field, and IMEC, an independent nanoelectronics research institute, announced that they have signed an agreement to jointly develop manufacturing technology for high efficiency LED (light emitting diode) devices. The agreement marks the first time Taiyo Nippon Sanso collaborates with an advanced research centre based in Europe.
There is an increasing demand to develop brighter green LEDs for future applications such as back light for high vision LCD television. Under the agreement, Taiyo Nippon Sanso and IMEC will develop high efficiency green LED device manufacturing technology based on IMEC's compound semiconductors device technology. Research is mainly carried out at the IMEC facilities in Leuven, Belgium and builds on IMEC's expertise in strain engineering on large wafer diameter, supported by in-situ growth monitoring.
"The collaboration with Taiyo Nippon Sanso, a total solution provider in the compound semiconductor field including metal organic materials, gas supply system, purification, abatement system and MOCVD tool, enables us to accelerate the development of high efficiency green LED manufacturing technology;" said Prof. Gilbert Declerk, President and CEO of IMEC.
"This relationship with IMEC will enable Taiyo Nippon Sanso to position itself as a leading MOCVD tool maker in the LED compound semiconductor market;" said Mike Hara, Senior Managing Director of Taiyo Nippon Sanso Corporation.
There is an increasing demand to develop brighter green LEDs for future applications such as back light for high vision LCD television. Under the agreement, Taiyo Nippon Sanso and IMEC will develop high efficiency green LED device manufacturing technology based on IMEC's compound semiconductors device technology. Research is mainly carried out at the IMEC facilities in Leuven, Belgium and builds on IMEC's expertise in strain engineering on large wafer diameter, supported by in-situ growth monitoring.
"The collaboration with Taiyo Nippon Sanso, a total solution provider in the compound semiconductor field including metal organic materials, gas supply system, purification, abatement system and MOCVD tool, enables us to accelerate the development of high efficiency green LED manufacturing technology;" said Prof. Gilbert Declerk, President and CEO of IMEC.
"This relationship with IMEC will enable Taiyo Nippon Sanso to position itself as a leading MOCVD tool maker in the LED compound semiconductor market;" said Mike Hara, Senior Managing Director of Taiyo Nippon Sanso Corporation.
