News Article
SMIC improves CIS devices
The foundry successfully developed 0.11 Micron CIS process technology.
Semiconductor Manufacturing International Corporation (SMIC), a semiconductor foundry, announced that it has successfully developed a 0.11 micron CMOS image sensor (CIS) process technology. With this new production process, SMIC manufactured CIS devices exhibit improved resolution, low noise, and enhanced image contrast for high performance CMOS imaging applications.
SMIC offers complete CIS foundry service in China, and its CIS 0.11μm capability builds on its extensive experience in the field, giving customers a solution at competitive costs while complementing its existing 0.18μm and 0.15μm CIS technologies. The 0.11μm CIS technology, available with both aluminium and copper backend metallisation, for highly integrated, high density CIS solutions, is ideal for a wide range of applications, including camera phones, computer cameras, and industrial and security monitoring devices. SMIC has begun pilot production for customers to take full advantage of this proven technology, which can be manufactured on 200mm and 300mm wafers.
Paul Ouyang, SMIC vice president of marketing and sales said, "Using optimised process conditions, we've successfully reduced dark noise, enabling performance in low light environments. These features deliver to our customers a high performance product at a reasonable cost, which allows them to enhance their competitiveness and gain leading positions in an ever growing CIS market."
SMIC offers complete CIS foundry service in China, and its CIS 0.11μm capability builds on its extensive experience in the field, giving customers a solution at competitive costs while complementing its existing 0.18μm and 0.15μm CIS technologies. The 0.11μm CIS technology, available with both aluminium and copper backend metallisation, for highly integrated, high density CIS solutions, is ideal for a wide range of applications, including camera phones, computer cameras, and industrial and security monitoring devices. SMIC has begun pilot production for customers to take full advantage of this proven technology, which can be manufactured on 200mm and 300mm wafers.
Paul Ouyang, SMIC vice president of marketing and sales said, "Using optimised process conditions, we've successfully reduced dark noise, enabling performance in low light environments. These features deliver to our customers a high performance product at a reasonable cost, which allows them to enhance their competitiveness and gain leading positions in an ever growing CIS market."
