News Article
SMIC received U.S. export licenses for 32nm technologies
The company can now start flash R&D in its manufacturing facilities.
Semiconductor Manufacturing International Corporation, a semiconductor foundry announced that SMIC would officially enter the 32nm technology era in January 2009.
Under U.S. Government export license rules, SMIC can launch 32nm logic process development as early as January 1, 2009 in all of its own manufacturing facilities.
In addition, under individual validated licenses recently granted by the U.S. Government, SMIC can start 32nm flash R&D as early as January 1, 2009 in the 300mm fab that it manages and operates in Wuhan (Wuhan Xinxin International Corporation). SMIC also recently entered into an agreement with Spansion to consider the manufacture of 32nm flash memory in 2010.
Matthew Szymanski, vice president for corporate relations and manager of export compliance for SMIC, said, "SMIC is happy to gain the 32nm approvals, which provide us the flexibility to deliver our technology advancement and fortify our leadership position in China."
Under U.S. Government export license rules, SMIC can launch 32nm logic process development as early as January 1, 2009 in all of its own manufacturing facilities.
In addition, under individual validated licenses recently granted by the U.S. Government, SMIC can start 32nm flash R&D as early as January 1, 2009 in the 300mm fab that it manages and operates in Wuhan (Wuhan Xinxin International Corporation). SMIC also recently entered into an agreement with Spansion to consider the manufacture of 32nm flash memory in 2010.
Matthew Szymanski, vice president for corporate relations and manager of export compliance for SMIC, said, "SMIC is happy to gain the 32nm approvals, which provide us the flexibility to deliver our technology advancement and fortify our leadership position in China."
