News Article
SUSS MicroTec and STS take to the road
Both companies announce seminar series in Asia on innovative process solutions for 3D integration.
SUSS MicroTec and Surface Technology Systems, two providers of process and test solutions for the semiconductor industry are hosting an advanced technology road show in five major cities in Asia from October 29 to November 7. The series of one day events is building on the success of the US road show this spring and will provide a comprehensive overview of the latest developments in the field of 3D integration and advanced packaging,
Invited speakers from companies such as Panasonic, IBM and Fraunhofer IZM will discuss the optimisation of integrated process solutions in respect to performance and cost. Topics cover applications like plasma dicing, metal to metal wafer level bonding, electrostatic carriers for thin wafer handling, as well as thin chip integration. SUSS MicroTec with STS and their parent company Sumitomo Precision Products (SPP), will demonstrate total process solutions for 3D wafer level packaging by combining the expertise of STS and SPP in deep reactive ion etch (DRIE) for via fabrication and SUSS MicroTec in photolithography and wafer bonding.
The road show will take place at following dates and locations:
Tokyo, Japan: October, 29
Shanghai, China: October, 31
Seoul, South Korea: November, 3
Hsinchu, Taiwan: November, 5
Singapore: November, 7
Invited speakers from companies such as Panasonic, IBM and Fraunhofer IZM will discuss the optimisation of integrated process solutions in respect to performance and cost. Topics cover applications like plasma dicing, metal to metal wafer level bonding, electrostatic carriers for thin wafer handling, as well as thin chip integration. SUSS MicroTec with STS and their parent company Sumitomo Precision Products (SPP), will demonstrate total process solutions for 3D wafer level packaging by combining the expertise of STS and SPP in deep reactive ion etch (DRIE) for via fabrication and SUSS MicroTec in photolithography and wafer bonding.
The road show will take place at following dates and locations:
Tokyo, Japan: October, 29
Shanghai, China: October, 31
Seoul, South Korea: November, 3
Hsinchu, Taiwan: November, 5
Singapore: November, 7
