Presto and SEMICAPS announce OEM Relationship
The two companies have established a technical and commercial relationship covering the Presto Allegheny thermal control system for in-silicon circuit analysis for high-power devices. SEMICAPS is now authorized as a re-seller of the Allegheny system for use with their SOM series of inverted scanning optical microscope systems.
“I am very happy to expand our collaboration with a leader like SEMICAPS,” stated Dr. Michel Villemain, Presto Engineering CEO. “While we’ve successfully used the SOM 4000 on our floor with an increasing number of our customers, we have developed a growing synergy between a service and a system model; this is now significantly enhanced by our work integrating a novel concept like Allegheny with the SEMICAPS SOM.”
Presto has recently achieved Platinum Level status in the SEMICAPS Certification Program for Performance Based Analysis Labs (PBAL). The Certification Program was established by SEMICAPS to assist end-customers in determining which service companies have equipment that relates to their requirements.
“Presto, by achieving Platinum Level of performance and combining it with new products like Allegheny, shows the next-generation capabilities available at their lab,” said Dr. Jacob Phang, SEMICAPS President. “It is our intention to continue as the exclusive Supplier-of-Choice for all PBALs. Presto’s Allegheny allows SEMICAPS to provide cooling for high-power devices in one system, covering photon emission, laser stimulation (TIVA/OBIRCH), and backside timing. Not only is Allegheny compatible with both our down-looking and inverted systems, it will allow super-low temperature environmental testing of parts to below -45C.”
The Allegheny thermal control system is based on an innovative design that combines a diamond-based heat-spreader with a novel method to clamp the device-under-test (DUT). The patent-pending system can be installed in most state-of-the art backside in-silicon analysis systems and enables imaging with air-gap and immersion lenses. In addition it does not require liquid to be in contact with the DUT, enabling high-power devices to be analyzed in-silicon while being tested—the most advanced method for modern semiconductor bring-up and failure analysis. Allegheny accommodates most packages and is easily adaptable to customer sockets. The system allows all optical analysis techniques to be performed through its diamond window, while maintaining the device temperature across the full commercial temperature range, for precise silicon analysis. With its unique thermal conduction efficiency, device temperature can be held within a predictable range, even at power levels beyond 300 watts.
