News Article
Repeat orders for FSI
FSI International receives repeat order for photolithography system from a gallium arsenide foundry. The company experiences continued growth in broadband wireless and wireline communications market.
FSI International, a supplier of surface conditioning and micro lithography equipment for microelectronics manufacturing, announced that it has received a repeat order for a micro lithography system from a gallium arsenide (GaAs) device foundry.
"We are experiencing increased POLARIS system interest from the rapidly growing broadband wireless and wireline communications component manufacturers,” stated Don Mitchell, FSI’s chairman and CEO. “Our POLARIS product’s flexibility allows our customers to process GaAs and gallium nitride (GaN) substrates in multiple sizes within the same system with no hardware or software changes. The ability to process multiple wafer sizes simultaneously provides a greater degree of flexibility without compromising process performance.”
Orders within the broadband wireless and wireline communications device suppliers are expected to increase, with FSI placing emphasis on continued expansion into this key market.
FSI's micro lithography systems provide adhesion and resist coating, as well as baking, chilling and developing processes for wafer sizes between 100mm and 300mm. With a large installed base, the systems already serve many applications and industries, including thin film head, medical and GaAs.
"We are experiencing increased POLARIS system interest from the rapidly growing broadband wireless and wireline communications component manufacturers,” stated Don Mitchell, FSI’s chairman and CEO. “Our POLARIS product’s flexibility allows our customers to process GaAs and gallium nitride (GaN) substrates in multiple sizes within the same system with no hardware or software changes. The ability to process multiple wafer sizes simultaneously provides a greater degree of flexibility without compromising process performance.”
Orders within the broadband wireless and wireline communications device suppliers are expected to increase, with FSI placing emphasis on continued expansion into this key market.
FSI's micro lithography systems provide adhesion and resist coating, as well as baking, chilling and developing processes for wafer sizes between 100mm and 300mm. With a large installed base, the systems already serve many applications and industries, including thin film head, medical and GaAs.
