News Article
Semitool and OLOVO reach agreement
OLOVO announces agreement for supplying advanced packaging wafer bumping plating anodes.
The low alpha and interconnect materials supplier, has reached an agreement with Semitool, whereby OLOVO has become licensed to supply anodes for use in Semitool’s electrochemical deposition systems.
The company’s qualification as an authorised vendor allows OLOVO to expand the reach of its low alpha products to Semitool’s customer base and to provide them with an additional source of specialty low alpha and interconnect materials.
According to Peter Emanuel, VP of sales at OLOVO, "We are extremely happy with this arrangement with Semitool, and we look forward to supplying Semitool's customer base with high quality plating anodes, which are a key component in the wafer bumping process. We believe this offers tremendous mutual benefit to our respective companies and clients."
The company’s qualification as an authorised vendor allows OLOVO to expand the reach of its low alpha products to Semitool’s customer base and to provide them with an additional source of specialty low alpha and interconnect materials.
According to Peter Emanuel, VP of sales at OLOVO, "We are extremely happy with this arrangement with Semitool, and we look forward to supplying Semitool's customer base with high quality plating anodes, which are a key component in the wafer bumping process. We believe this offers tremendous mutual benefit to our respective companies and clients."