News Article
SenterNovem provides €5 million innovation loan to MAPPER
MAPPER Lithography has received a $5 million innovation loan from SenterNovem, the innovation agency of the Dutch Ministry of Economic Affairs, to further develop its highly innovative lithography machine for the manufacturing of chips.
The company previously announced a technological breakthrough in 2007 when the company demonstrated that through the use of parallel electron beams, electronic circuits can be imaged directly onto the chip, thereby eliminating expensive masks required to project the image of the switches in conventional lithography machines. According to TSMC, the world’s leading semiconductor contract manufacturer, who recently acquired MAPPER’s first machine, MAPPER’s solution is a serious candidate to become the future lithography standard, because it holds great promise for cost effective manufacturing at 22nm and beyond.
MAPPER’s CFO Jaap Bastiaansen comments that “MAPPER regards the loan as a recognition of the innovative power and international commercial potential of maskless lithography machines. Next to this MAPPER’s innovative technology will further enhance the strong reputation Dutch lithography companies enjoy throughout the world. At MAPPER, we feel it is important that we can continue to rely on SenterNovem’s support in the coming years.”
The innovation loan allows MAPPER to accelerate its continued development of prototypes. The machines will be ready for chip manufacturing at the 22nm node, so as to be able to meet the rapidly growing demand for increasingly small, increasingly powerful and increasingly inexpensive chips.
MAPPER’s CFO Jaap Bastiaansen comments that “MAPPER regards the loan as a recognition of the innovative power and international commercial potential of maskless lithography machines. Next to this MAPPER’s innovative technology will further enhance the strong reputation Dutch lithography companies enjoy throughout the world. At MAPPER, we feel it is important that we can continue to rely on SenterNovem’s support in the coming years.”
The innovation loan allows MAPPER to accelerate its continued development of prototypes. The machines will be ready for chip manufacturing at the 22nm node, so as to be able to meet the rapidly growing demand for increasingly small, increasingly powerful and increasingly inexpensive chips.
