News Article
EV Group introduces new 3D IC systems
A new suit of aligners and measurement systems for 3D IC and other advanced semiconductor, MEMS and nanotechnology devices manufacturing has been introduced by EVG which is expected to increase performance significantly.
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the NT series, a new, yet already field proven suite of mask aligners, wafer to wafer (W2W) bond aligners and measurement systems, to address increased demand for higher precision alignment accuracy. The shift to smaller geometries along with more feature dense packages adds a host of challenges, surrounding precision alignment capabilities, which can greatly impact device failure intolerance and, ultimately, yield and cost. The new series offers significantly increased alignment accuracy for the manufacture of advanced MEMS, compound semiconductor, silicon based power, 3D IC and nanotechnology devices, in the range of 1 μm down to 0.1 μm. First units of the new systems have already been installed at customer sites worldwide and passed the acceptance tests.
"Structural integrity and, ultimately, device performance is impacted by alignment inaccuracies throughout the production process, increasing the total cost of manufacturing," said Paul Lindner, EVG's executive technology director. "There are a host of variables to consider in the manufacturing process that can affect alignment accuracy, including temperature and substrate materials, and the movement to smaller, more feature dense packages greatly exacerbates the problem. In fulfilling our commitment to enabling our customers, we have introduced the EVG-NT series to solve these issues. We're pleased to report that customers have already qualified our first systems in the field, and that data have confirmed our quoted specifications. This is testament to our triple 'i' philosophy of invent, innovate and implement, and we look forward to pushing the envelope in enabling next generation manufacturing needs."
The EVG-NT series features next generation alignment and measurement systems with significantly increased alignment precision. The series is composed of the following mask aligners, a W2W bond aligner, and an alignment measurement system.
"Structural integrity and, ultimately, device performance is impacted by alignment inaccuracies throughout the production process, increasing the total cost of manufacturing," said Paul Lindner, EVG's executive technology director. "There are a host of variables to consider in the manufacturing process that can affect alignment accuracy, including temperature and substrate materials, and the movement to smaller, more feature dense packages greatly exacerbates the problem. In fulfilling our commitment to enabling our customers, we have introduced the EVG-NT series to solve these issues. We're pleased to report that customers have already qualified our first systems in the field, and that data have confirmed our quoted specifications. This is testament to our triple 'i' philosophy of invent, innovate and implement, and we look forward to pushing the envelope in enabling next generation manufacturing needs."
The EVG-NT series features next generation alignment and measurement systems with significantly increased alignment precision. The series is composed of the following mask aligners, a W2W bond aligner, and an alignment measurement system.
