News Article
Boin celebrates a decade
2008 marks the 10th anniversary of the startup of Boin GmbH, a semiconductor software supplier. The company was founded 1998 and introduced the WAFERMAP metrology software.
WAFERMAP is an award winning software package used to collect, edit, analyse and visualise measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
Later, a software development kit for both the semiconductor and disk drive industry was introduced. It offers the 9 different types of graphics of WAFERMAP as an ActiveX control.
Then, in mid of 2007, a completely new product for flat panel and related industries was released. It is called PANELMAP and enables the user to perform similar functions available in WAFERMAP but on rectangular panels.
WAFERMAP software is in use at a large number of IC and equipment manufacturers such as AMD, ASM, Infineon, KLA-Tencor, LSI Logic, Mattson, MEMC, Varian or Wacker Siltronic. Software products from Boin GmbH have been integrated with a number of metrology tools in the semiconductor market and OEM agreements have been signed with manufacturers of metrology equipment. OEM customers such as Eichhorn & Hausmann, Foothill Instruments, Hypernex, Jordan Valley, Nicolet, Sigmatech, Sopra, Technos, Thermo, Timbre or Zeiss benefit from WAFERMAP, PANELMAP and WAFERView.OCX by quick and easy integration into metrology applications and therefore save development time and costs.
Up to now more than 1000 licences of Boin's products have been sold to more than 150 direct customers and about 300 users of OEM tools.
Later, a software development kit for both the semiconductor and disk drive industry was introduced. It offers the 9 different types of graphics of WAFERMAP as an ActiveX control.
Then, in mid of 2007, a completely new product for flat panel and related industries was released. It is called PANELMAP and enables the user to perform similar functions available in WAFERMAP but on rectangular panels.
WAFERMAP software is in use at a large number of IC and equipment manufacturers such as AMD, ASM, Infineon, KLA-Tencor, LSI Logic, Mattson, MEMC, Varian or Wacker Siltronic. Software products from Boin GmbH have been integrated with a number of metrology tools in the semiconductor market and OEM agreements have been signed with manufacturers of metrology equipment. OEM customers such as Eichhorn & Hausmann, Foothill Instruments, Hypernex, Jordan Valley, Nicolet, Sigmatech, Sopra, Technos, Thermo, Timbre or Zeiss benefit from WAFERMAP, PANELMAP and WAFERView.OCX by quick and easy integration into metrology applications and therefore save development time and costs.
Up to now more than 1000 licences of Boin's products have been sold to more than 150 direct customers and about 300 users of OEM tools.
